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US 10,330,304 B2Granted
Heatsink including thick film layer for UV LED arrays, and methods of forming UV LED arrays
AssigneeHeraeus Noblelight America LLC
InventorsWilliam E. Johnson, III, Darrin Leonhardt, Mahmood Gharagozloo
Life of this patent
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Abstract
An ultraviolet LED array is provided. The ultraviolet LED array includes a heatsink. The heatsink includes (i) a base heatsink element, and (ii) a thick film layer applied to the base heatsink element. The ultraviolet LED array also includes a plurality of ultraviolet LED elements coupled directly to the thick film layer of the heatsink.
Claims20
An ultraviolet LED array comprising:
- a heatsink, the heatsink including (i) a base heatsink element, and (ii) a thick film layer applied to the base heatsink element, the thick film layer including a dielectric layer applied to the base heatsink element, a conductive layer applied to the dielectric layer, and a solder mask layer applied to the conductive layer, wherein the heatsink including the base heatsink element and the thick film layer is a monolithic structure;
- and
- a plurality of ultraviolet LED elements coupled directly to the thick film layer of the heatsink.
A method of forming an ultraviolet LED array, the method comprising the steps of:
- (a) selectively applying a thick film layer to a surface of a base heatsink element;
- (b) firing the base heatsink element, and the thick film layer applied to the base heatsink element, to form a heatsink;
- and
- (c) attaching a plurality of UV LED elements directly to the thick film layer of the heatsink.
1 more element
A method of forming an ultraviolet LED array, the method comprising the steps of:
- (a) selectively applying a thick film dielectric layer to a surface of a base heatsink element;
- (b) selectively applying a thick film conductive layer to the thick film dielectric layer applied to the surface of the base heatsink element in step (a);
- (c) selectively applying a solder mask layer to the thick film conductive layer applied to the surface of the thick film dielectric layer in step (b);
- and
- (d) attaching a plurality of UV LED elements to the solder mask layer.
2 more elements
Dependencies are inferred from the claim text.