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US 10,329,680 B2Granted
Plating solution using sulfonium salt
AssigneeMitsubishi Materials Corporation
InventorsKiyotaka Nakaya, Mami Watanabe
Life of this patent
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Abstract
A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing sulfonium salt with one or more of aromatic rings is provided.
Claims4
A plating solution for electrodeposition comprising:
- (A) a soluble salt containing at least a stannous salt in an amount of 30 to 100 g/L;
- (B) an acid selected from an organic acid and an inorganic acid, or a salt of the acid, in an amount of 80 to 300 g/L;
- and
- (C) an additive, wherein
- the additive comprises a sulfonium salt in an amount of 0.1 to 10 g/L, the sulfonium salt having one or more of aromatic rings represented by a general formula (1) below,
- wherein, R1 and R2 in the formula (1) are identical or different, and are any one of a phenyl group, a hydroxyphenyl group, a tolyl group, a hydrogen atom, CnH2n+1, n being an integer from 1 to 5,
- Ph represents a phenyl group, and
- X represents a halogen.
5 more elements
Dependencies are inferred from the claim text.