Deposition apparatus and deposition method

A plasma enhanced atomic layer deposition (PEALD) method using a plurality of reactors, the method comprising the steps of:

• (a) preparing a deposition apparatus including a plurality of reactors including first to fourth reactors, a plurality of gas supply units including a first gas supply unit connected to the first and third reactors and a second gas supply unit connected to the second and fourth reactors, and a plurality of plasma supply units including a first plasma supply unit connected to the first and second reactors and a second plasma supply unit connected to the third and fourth reactors;
• (b) supplying source gas to the first and third reactors through the first gas supply unit;
• (c) supplying reactant gas to the first and third reactors through the first gas supply unit, and supplying source gas to the second and fourth reactors through the second gas supply unit;
• (d) applying a reverse voltage to a first diode of the first plasma supply unit connected to the first reactor to supply plasma power to the first reactor, and applying a reverse voltage to a third diode of the second plasma supply unit connected to the third reactor to supply plasma power to the third reactor;
• (e) supplying source gas to the first and third reactors through the first gas supply unit and supplying reactant gas to the second and fourth reactors through the second gas supply unit;
• and
• (f) applying a reverse voltage to a second diode of the first plasma supply unit connected to the second reactor to supply plasma power to the second reactor, and applying a reverse voltage to a fourth diode of the second plasma supply unit connected to the fourth reactor to supply plasma power to the fourth reactor.