Back to results
US 10,329,468 B2Granted
Thermally conductive resin and thermal interface material comprising the same
AssigneeIndustrial Technology Research Institute
InventorsYen-Chun Liu, Hui-Wen Chang, Min-Chian Wang, Kuo-Chan Chiou
Life of this patent
Estimating the term…
Abstract
A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.
Claims6
A thermally conductive resin, represented by formula (I):
- wherein
- X1 is
- X2 is
- m is an integer ranging from 5 to 30,
- n is an integer ranging from 5 to 15, and
- o is an integer ranging from 40 to 80, wherein
- m:n:o=5-30:5-15:40-80.
4 more elements
Dependencies are inferred from the claim text.