Epoxy resin composition
AssigneeHenkel AG & Co. KGaA
InventorsChristian Holtgrewe, Harald Kuester, Thomas Bachon, Rainer Schoenfeld
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Abstract
The present invention relates to adhesive compositions containing a prepolymer which can be obtained by reacting a reaction mixture containing: at least one epoxy resin; at least one polyetherdiamine or polyethertriamine; at least one carboxyl-terminated butadiene-acrylonitrile copolymer (CTBN); and rubber particles having a core/shell structure. The invention also relates to methods for curing said compositions, to the cured adhesive compositions thus obtained, to the use thereof for bonding components and to the components thus obtained.
Claims9
An adhesive composition, comprising:
- a curable epoxy prepolymer, a curing agent, and rubber particles having a core/shell structure;
- wherein the curable epoxy prepolymer is obtained by reacting (a), (b), and (c) in a reaction mixture containing (a), (b), (c), and (d):
- (a) at least one epoxy resin having at least two 1,2-epoxy groups per molecule;
- (b) at least one polyetherdiamine or polyethertriamine;
- (c) at least one carboxyl-terminated butadiene-acrylonitrile copolymer (CTBN) or epoxy resin adduct thereof;
- and
- (d) said rubber particles having a core/shell structure;
- wherein a total of epoxy groups in the reaction mixture is in excess relative to a total of epoxy-reactive groups in the reaction mixture;
- wherein the reaction mixture does not contain a diglycidyl ether epoxy resin which is solid at room temperature;
- and
- wherein a cured product of the adhesive composition has:
- a modulus of elasticity of <800 MPa and/or a glass transition temperature Tg of >100° C.
Dependencies are inferred from the claim text.