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US 10,329,457 B2Granted
Conductive pressure-sensitive adhesive tape
AssigneeNitto Denko Corporation
InventorsAkira Hirao, Ryo Morioka
Life of this patent
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Abstract
Provided is a conductive pressure-sensitive adhesive tape having high flexibility. The conductive pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer arranged on at least one surface side of the base material, in which the tape has a total thickness of 30 μm or less.
Claims7
A conductive pressure-sensitive adhesive tape, comprising:
- a base material comprising a metal, the base material having a first side and a second side opposite the first side, and having a thickness from 1 μm to 9 μm;
- a first pressure-sensitive adhesive layer on the first side of the base material, the first pressure-sensitive adhesive layer having a thickness from 7 μm to 10 μm;
- and
- a second pressure-sensitive adhesive layer on the second side of the base material, the second pressure-sensitive adhesive layer having a thickness from 7 μm to 10 μm,
- wherein the tape has a total thickness of 15 μm to 29 μm.
2 more elements
Dependencies are inferred from the claim text.