Materials and spin coating methods suitable for advanced planarization applications

A method of applying a coating onto a substrate, comprising:

• dispensing the coating onto the substrate, wherein the coating includes:
• a resin comprising one or more silicon-based materials, one or more organic-based materials, or a combination of silicon-based materials and organic-based materials;
• at least one first solvent having a boiling point from 140° C. to 250° C.;
• and at least one second solvent having a boiling point from 50° C. to 120° C.;
• wherein a weight ratio of the first solvent to the second solvent is from 1:1 to 1:5;
• spinning the substrate at a first speed, at least one of prior to and during the dispensing step;
• spinning the coating at a second speed that is less than or equal to the first speed such that the coating spreads over the surface of the substrate, achieves a planar surface, and evaporates the second solvent;
• increasing the speed to a third and final speed that is greater than the first speed and the second speed such that a desired film thickness is established;
• and
• providing a stop time of between 10 and 60 seconds after the third and final speed before
• a subsequent heating to facilitate flow to achieve the planar surface;
• wherein the first speed is between 100 revolutions per minute and 500 revolutions per minute;
• the second speed is between 0 revolutions per minute and 500 revolutions per minute;
• and
• the third and final speed is between 1000 revolutions per minute and 5000 revolutions per minute.