Microstructured device with embossed layer
AssigneeViavi Solutions Inc.
InventorsAlberto Argoitia, Lily O'Boyle, Cornelis Jan Delst, Laurence Holden
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Abstract
A security device has a support substrate of a first material having a softening temperature t1 and an embossed layer of a second different material supported by the support substrate having a softening temperature t2, wherein t2<t1. A thin film coating deposited directly upon the embossed layer, wherein the embossed layer is capable of being dissolved in a dissolving agent and wherein the thin film coating is not dissolvable by said dissolving agent. There is not need for an additional release layer as the second different material is dissolvable and allows flakes to be formed by dissolving the second layer.
Claims20
A multilayer device comprising:
- a substrate layer comprising a first material having a first softening temperature;
- an embossed layer comprising a second material having a second softening temperature,
- the second softening temperature being less than the first softening temperature,
- the second softening temperature being at least 10 degrees Celsius less than the first softening temperature, and
- a glass transition temperature of the embossed layer being between 70 and 200 degrees Celsius;
- and
- a thin film coating that is deposited directly upon the embossed layer,
- the thin film coating comprising a first absorber layer, a second absorber layer, and a dielectric layer,
- the dielectric layer being between the first absorber layer and the second absorber layer, and
- the embossed layer being capable of being completely dissolved in a dissolving agent while the thin film coating is not dissolvable by the dissolving agent.
A device comprising:
- a first layer comprising a first material having a first softening temperature;
- a second layer comprising a second material having a second softening temperature,
- the second softening temperature being less than the first softening temperature,
- the second softening temperature being at least 10 degrees Celsius less than the first softening temperature,
- a glass transition temperature of the second layer being between 70 and 200 degrees Celsius, and the second layer being an embossed layer of having a microstructure;
- and
- a thin film coating that is deposited directly upon the second layer,
- the second layer being capable of being completely dissolved in a dissolving agent while the thin film coating is not dissolvable by the dissolving agent.
Dependencies are inferred from the claim text.