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US 10,329,205 B2Granted
Bond layer for silicon-containing substrates
AssigneeROLLS-ROYCE plc
InventorsSean E. Landwehr, Kang N. Lee, Adam Lee Chamberlain
Life of this patent
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Abstract
In some examples, an article may include a substrate and a coating on the substrate. In accordance with some of these examples, the coating may include a bond layer and an overlying layer comprising at least one oxide. In some examples, the bond layer comprises silicon metal and at least one of a transition metal carbide, a transition metal boride, or a transition metal nitride.
Claims20
An article comprising:
- a substrate;
- and
- a coating on the substrate, wherein the coating comprises a bond layer and an overlying layer comprising at least one oxide, wherein the bond layer comprises between 40 volume percent and 99 volume percent silicon metal and a balance of at least one of a transition metal carbide, a transition metal boride, or a transition metal nitride.
A method comprising:
- forming a bond layer comprising silicon metal between 40 volume percent and 99 volume percent and a balance of at least one of a transition metal carbide, a transition metal boride, or a transition metal nitride on a substrate;
- and
- forming an overlying layer comprising an oxide on the bond layer.
Dependencies are inferred from the claim text.