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US 10,328,694 B2Granted
Printed circuit board with recessed pocket for fluid droplet ejection die
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien Hua Chen, Diane R Hammerstad, Randy Hoffman
Life of this patent
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Abstract
A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket.
Claims11
An apparatus comprising:
- a printed circuit board comprising a recessed pocket;
- and
- a fluid droplet ejection die within the recessed pocket, wherein the printed circuit, board comprises:
- a first core layer;
- first electrically conductive traces on the first core layer;
- a second core layer;
- second electrically conductive traces on the second core layer;
- and
- a binding layer joining the first core layer to the second, core layer.
6 more elements
A printed circuit board for use with a fluid droplet ejection die having a thickness, the printed circuit board comprising:
- a recessed pocket having a floor and sized to receive the fluid droplet ejection die and having a depth greater than or equal to 150 micrometers;
- and
- an electrical contact pad on the floor, wherein the contact pad is exposed within the recessed pocket.
Dependencies are inferred from the claim text.