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US 10,328,549 B2Granted
Polishing head, chemical-mechanical polishing system and method for polishing substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Bin Hsu, Ren-Guei Lin, Feng-Inn Wu, Sheng-Chen Wang, Jung-Yu Li
Life of this patent
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Abstract
A polishing head includes a carrier head and a plurality of pressure units arranged on the carrier head. At least two of the pressure units are located on the same circumferential line relative to a center axis of the carrier head.
Claims20
A polishing head for a chemical-mechanical polishing system, the polishing head comprising:
- a carrier head;
- a plurality of fluidly isolated pressure units arranged on the carrier head, wherein at least two of the fluidly isolated pressure units overlap the same circumferential line relative to a center axis of the carrier head, wherein at least one of the pressure units comprises a bottom wall made out of a flexible material;
- and
- a piezoelectric layer in a position lower than bottom surfaces of the pressure units, the piezoelectric layer being wider than a pressure chamber in one of the pressure units and having a portion overlapping the pressure chamber.
1 more element
A chemical-mechanical polishing system comprising:
- a polishing head comprising a carrier head defining a center axis and a plurality of circumferential lines surrounding the center axis, wherein only one of the circumferential lines has a plurality of fluidly isolated pressure units arranged thereon;
- a platen disposed below the polishing head;
- a slurry introduction mechanism disposed above the platen;
- a piezoelectric layer located under the pressure units;
- a partition wall separating pressure chambers in the pressure units, the piezoelectric layer extending across the partition wall;
- and
- a bottom wall sealing bottoms of the pressure units.
4 more elements
A chemical-mechanical polishing system comprising:
- a polishing head comprising:
- a carrier head;
- a plurality of concentric partition walls;
- a plurality of radial partition walls extending from an innermost partition wall of the plurality of the concentric partition walls to an outermost partition wall of the plurality of the concentric partition walls, wherein the radial partition walls are made of a flexible material;
- and
- a plurality of individually actuatable pressure units overlapping the same circumferential line relative to a center axis of the carrier head when viewed from above along a direction of the center axis of the carrier head;
- a platen disposed below the polishing head;
- a slurry introduction mechanism disposed above the platen;
- and
- a piezoelectric layer between the platen and the pressure units, a pressure chamber in one of the pressure units being narrower than the piezoelectric layer and overlapping a portion of the piezoelectric layer.
7 more elements
Dependencies are inferred from the claim text.