Polishing-layer molded body, and polishing pad
AssigneeKuraray Co., Ltd.
InventorsKiyofumi Kadowaki, Shinya Kato, Chihiro Okamoto, Mitsuru Kato, Minori Takegoshi
Life of this patent
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Abstract
Disclosed is a polishing-layer molded body including: a thermoplastic polyurethane that is a polymer of a monomer including: a polymer diol; an organic diisocyanate; a first chain extender including a diol having 4 or less carbon atoms; a second chain extender including a diol having 5 or more carbon atoms, a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate being 6.3 to 7.4 mass %, and the polishing-layer molded body being non-porous.
Claims12
A polishing-layer molded body, comprising a thermoplastic polyurethane that is a polymer of monomer units including:
- a polymer diol;
- an organic diisocyanate;
- a first chain extender including a diol having 4 or less carbon atoms;
- and
- a second chain extender including a diol having 5 or more carbon atoms, wherein:
- a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate is 6.3 to 7.4 mass %;
- and
- the polishing-layer molded body is non-porous.
Dependencies are inferred from the claim text.