Grinding apparatus and wafer processing method
AssigneeDisco Corporation
InventorKazuma Sekiya
Life of this patent
Estimating the term…
Abstract
A grinding apparatus includes a chuck table for holding a wafer having a modified layer near the front side or a groove on the front side, the groove having a depth not less than a finished thickness of the wafer, a grinding unit for grinding the back side of the wafer to divide the wafer into a plurality of chips, a die strength measuring unit for measuring the die strength of any one of the chips, and a control unit for controlling each component according to a measured value of die strength. The control unit determines that grinding is not to be performed on the remaining wafers stored in the cassette when the measured value is less than a threshold value, and determines that grinding is to be performed on the remaining wafers when the measured value is greater than or equal to the threshold value.
Claims3
A grinding apparatus comprising:
- a chuck table for holding the front side of a wafer having a modified layer near the front side or a groove on the front side, said groove having a depth not less than a finished thickness of said wafer;
- a grinding unit for grinding the back side of said wafer held on said chuck table to thereby divide said wafer into a plurality of chips along said modified layer or said groove;
- a cassette mounting area for mounting a cassette storing a plurality of wafers including said wafer;
- a loading unit for loading said wafer from said cassette mounted on said cassette mounting area to said chuck table;
- a die strength measuring unit for measuring the die strength of any one of said chips obtained by dividing said wafer in said grinding unit;
- and
- a control unit for controlling each component according to a measured value for the die strength measured by said die strength measuring unit;
- said control unit having a determining section for determining that grinding is not to be performed to the remaining wafers stored in said cassette when said measured value is less than a threshold value, whereas determining that grinding is to be performed to the remaining wafers stored in said cassette when said measured value is greater than or equal to said threshold value.
A wafer processing method using a grinding apparatus including a chuck table for holding the front side of a wafer having a modified layer near the front side or a groove on the front side, said groove having a depth not less than a finished thickness of said wafer, a grinding unit for grinding the back side of said wafer held on said chuck table to thereby divide said wafer into a plurality of chips along said modified layer or said groove, a cassette mounting area for mounting a cassette storing a plurality of wafers including said wafer, a loading unit for loading said wafer from said cassette mounted on said cassette mounting area to said chuck table, a die strength measuring unit for measuring the die strength of any one of said chips obtained by dividing said wafer in said grinding unit, and a control unit for controlling each component according to a measured value for the die strength measured by said die strength measuring unit, said control unit having a determining section for determining that grinding is not to be performed to the remaining wafers stored in said cassette when said measured value is less than a threshold value, whereas determining that grinding is to be performed to the remaining wafers stored in said cassette when said measured value is greater than or equal to said threshold value, said wafer processing method comprising:
- a front processing step of forming said modified layer near the front side of said wafer or said groove on the front side of said wafer;
- a protective member attaching step of attaching a protective member to the front side of said wafer after performing said front processing step;
- a grinding step of grinding by said grinding unit the back side of said wafer held through said protective member on said chuck table after performing said protective member attaching step, thereby dividing said wafer into said chips along said modified layer or said groove;
- and
- a determining step of measuring the die strength of any one of said chips obtained by dividing said wafer after performing said grinding step, and then determining that grinding is not to be performed to the remaining wafers stored in said cassette when said measured value is less than said threshold value, whereas determining that grinding is to be performed to the remaining wafers stored in said cassette when said measured value is greater than or equal to said threshold value.
Dependencies are inferred from the claim text.