Polishing cleaning mechanism, substrate processing apparatus, and substrate processing method

A polishing cleaning mechanism configured to be in contact with a part of a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, comprising:

• an annular polishing member configured to polish the rear surface of the substrate;
• a cleaning member configured to clean the rear surface of the substrate;
• and
• a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit,
• wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate have different heights from each other;
• wherein the cleaning member includes a plurality of fan-shaped members, and the fan-shaped members are disposed inside the polishing member to be concentric with the polishing member;
• and
• wherein a surface area of the polishing cleaning mechanism facing the substrate is smaller than a surface area of the substrate.