Self-heating solder flux material

A self-heating solder flux material comprising:

• a solder flux material that includes a solvent carrier;
• and a shell-in-shell microcapsule that includes:
• an inner shell contained within an outer shell, the inner shell encapsulating a first compartment that contains a first reactant;
• the outer shell that encapsulates a second compartment that contains a second reactant;
• and
• an isolating structure defined by the inner shell, the isolating structure separating the first compartment from the second compartment,
• wherein the isolating structure is adapted to rupture in response to exposure to a magnetic field, ultraviolet (UV) light, or a combination thereof, and
• wherein rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant that generates heat to volatilize the solvent carrier.

A process of utilizing a self-heating solder flux material, the process comprising:

• applying a self-heating solder flux material to a region of a printed circuit board,
• wherein the self-heating solder flux material includes:
• a solder flux material that includes a solvent carrier;
• and a multi-compartment microcapsule that includes:
• a first compartment that contains a first reactant;
• a second compartment that contains a second reactant;
• and
• an isolating structure separating the first compartment from the second compartment;
• performing a soldering operation at the region of the printed circuit board;
• and after performing the soldering operation, exposing the printed circuit board to a stimulus, wherein the isolating structure of the multi-compartment microcapsule is adapted to rupture in response to the stimulus, and wherein rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant that generates heat to volatilize the solvent carrier.