Piercing processing method and laser processing machine
AssigneeAmada Holdings Co., Ltd.
InventorsRuotao Li, Hiroaki Ishiguro
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AssigneeAmada Holdings Co., Ltd.
InventorsRuotao Li, Hiroaki Ishiguro
Estimating the term…
A piercing processing method and a laser processing machine capable of carrying out a piercing processing on a thick plate in short time are provided. It is a processing method for carrying out a piercing processing on a metallic material by laser beams with wavelengths in 1 μm band, where the piercing processing is carried out by maintaining a range of 8≤Zr/d≤12 when a condensed beam diameter of the laser beams is set to be d and a Rayleigh length of the laser beams is set to be Zr. At that time, a focal position of the laser beams is set to be on a surface of a workpiece or an external of the workpiece. Then, a beam profile of the laser beams is such that the laser beams of a single mode are converted into a bowler hat shape by a beam quality tunable device.
A processing method for carrying out a piercing processing on a metallic material by laser beams with wavelengths in 1 μm waveband, a piercing processing method comprising:
A laser processing machine for carrying out a piercing processing on a metallic material by laser beams with wavelengths in 1 μm waveband, the laser processing machine comprising:
Dependencies are inferred from the claim text.