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US 10,327,704 B2Granted
Dry bonding system and wearable device for skin bonding including the same
AssigneeResearch & Business Foundation Sungkyunkwan University
InventorsChanghyun Pang, Young Jin Park, Sang Yul Baik
Life of this patent
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Abstract
Disclosed are a dry bonding system and a wearable device for skin bonding including the dry bonding system.
Claims14
A bonding device, comprising:
- cylindrical micro structures each extending from a substrate and having a terminal end,
- wherein each of the micro structures includes a chamber extending into the terminal end, and
- wherein a diameter of an opening of the chamber at the terminal end is smaller than a diameter of the terminal end,
- wherein a protuberance extends from a floor of the chamber,
- wherein a circumference of a middle portion of the protuberance is larger than each of a circumference of an upper end of the protuberance and a circumference of a lower end of the protuberance, and
- wherein the circumference of the middle portion of the protuberance is smaller than a circumference of the chamber.
3 more elements
A bonding device, comprising:
- holes extending into a flat substrate;
- and
- a protuberance formed on a floor of each of the holes,
- wherein the protuberance has a height smaller than a depth of each of the holes,
- wherein a circumference of a middle portion of the protuberance is larger than each of a circumference of an upper end of the protuberance and a circumference of a lower end of the protuberance, and
- wherein the circumference of the middle portion of the protuberance is smaller than a circumference of each of the holes.
3 more elements
Dependencies are inferred from the claim text.