Neural-interface probe and methods of packaging the same
AssigneeParadromics, Inc.
InventorsMatthew R. Angle, Yifan Kong
Life of this patent
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Abstract
A neural-interface probe is provided. The probe may comprise a chip, a wire bundle substrate, and an encapsulant material. The chip may comprise a plurality of bond pads. The wire bundle substrate may comprise a plurality of wires extending through the substrate. The plurality of wires may comprise: (1) a proximal portion connected to the plurality of bond pads to thereby couple the chip to the substrate, and (2) a flexible distal portion configured to interface with neural matter. The encapsulant material may be disposed at least between the chip and the wire bundle substrate.
Claims24
A neural-interface probe comprising:
- a chip comprising a plurality of bond pads;
- a wire bundle substrate comprising a plurality of wires extending through said substrate, wherein the plurality of wires comprises:
- (1) a proximal portion connected to the plurality of bond pads to thereby couple the chip to said substrate, and (2) a flexible distal portion configured to interface with neural matter, wherein the proximal portion of the plurality of wires is connected to the plurality of bond pads via a plurality of interconnects comprising solder formed between the chip and the wire bundle substrate;
- and
- a housing formed by overmolding an epoxy block around the chip and the wire bundle substrate, wherein the housing is configured to seal the chip and substrate by entirely disposing the chip and the substrate within the epoxy block.
A method for forming a neural-interface probe, said method comprising:
- providing a chip that comprises a plurality of bond;
- providing a wire bundle substrate that comprises a plurality of wires extending through said substrate, wherein the plurality of wires comprises:
- (1) a proximal portion configured to be connected to the plurality of bond pads to thereby couple the chip to said substrate, and (2) a flexible distal portion configured to interface with neural matter;
- attaching the chip to the wire bundle substrate by connecting the proximal portion of the wires to the plurality of bond pads via a plurality of interconnects comprising solder formed between the chip and the wire bundle substrate;
- and
- overmolding a housing by providing an epoxy block entirely surrounding the chip and the wire bundle substrate to seal the chip and substrate.
Dependencies are inferred from the claim text.