# US 10,321,605 B2 · Heat sink > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,321,605 B2 - Document ID: US10321605B2 - Status: Granted - Kind: B2 - Application number: 14/906,235 - Filed: 2013-07-22 - Published: 2016-06-09 - Granted: 2019-06-11 - Earliest claimed: 2013-07-22 - Assignees: Hewlett Packard Enterprise Development LP - Applicants: Hewlett-Packard Development Company, L.P. - Inventors: John Norton - Web page: https://patentgrep.com/patent/US10321605B2 ## CPC - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - B23P 15/26: heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} - H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)} - H10W 40/43: by flowing gases, e.g. forced air cooling - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 40/73: for cooling by change of state - B23P 2700/09: Heat pipes - B23P 2700/10: Heat sinks - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B23P: METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS (arrangements for copying or controlling B23Q) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A heat sink assembly is provided herein. The heat sink assembly includes at least two heat sinks, a mechanical support member, and a flexible heat pipe. Each of the at least two heat sinks are formed to mate with one of at least two processors. The mechanical support member are formed to mechanically engage with the at least two heat sinks. The flexible heat pipe connects to the at least two heat sinks to provide a thermal link therebetween. ## Claims ### Claim 1 A heat sink assembly comprising: a first heat sink, formed to mate with a first processor along a first processor seating plane; a second heat sink, formed to mate with a second processor along a second processor seating plane; a mechanical support member that bends in correspondence with a height difference between the first processor seating plane and the second processor seating plane and formed to support the first heat sink and the second heat sink along the first processor seating plane and the second processor seating plane, respectively; and a flexible heat pipe between the first heat sink and the second heat sink to provide a thermal link therebetween. ### Claim 2 (depends on 1) The heat sink assembly of claim 1, wherein the flexible heat pipe to allow movement for an offset between the first heat sink and the second heat sink. ### Claim 3 (depends on 1) The heat sink assembly of claim 1, wherein the mechanical support member to provide flexibility for an offset between the first heat sink and the second heat sink. ### Claim 4 (depends on 1) The heat sink assembly of claim 1, wherein the flexible heat pipe forms a connection between a first set of fins formed in the first heat sink and a second set of fins formed in the second heat sink. ### Claim 5 (depends on 1) The heat sink assembly of claim 1, wherein the flexible heat pipe forms a connection between a first heat sink base formed in the first heat sink and a heat sink second base formed in the second heat sink. ### Claim 6 (depends on 1) The heat sink assembly of claim 1, wherein the mechanical support member comprises an elastic composition to provide mechanical support for the first heat sink along the first processor seating plane and the second heat sink along the second processor seating plane, wherein the first processor seating plane and the second processor seating plane lie along two distinct planes. ### Claim 7 (depends on 1) The heat sink assembly of claim 1, wherein the mechanical support member comprises a composition that allows for a small offset between the first processor seating plane and the second processor seating plane. ### Claim 8 A heat sink module comprising: at least two processors, each of the at least two processors positioned along a distinct processor seating plane; at least two heat sinks, each of the at least two heat sinks formed to mate with one of the at least two processors; a mechanical support member that bends in correspondence with a height difference between the first processor and the second processor and formed to mechanically engage with the at least two heat sinks; and a flexible heat pipe to connect the at least two heat sinks to provide a thermal link therebetween. ### Claim 9 (depends on 8) The heat sink module of claim 8, further comprising at least two central processing unit jackets, one of the at least two central processing unit jackets formed to attach to each of the at least two central processing units and align each of the at least two central processing units with each of the at least two heat sinks, respectively. ### Claim 10 (depends on 8) The heat sink module of claim 8, wherein the thermal link forms by embedding the flexible heat pipe between a set of heat sink fins on each of the at least two heat sinks. ### Claim 11 (depends on 8) The heat sink module of claim 8, wherein the thermal link forms by connecting the flexible heat pipe between a heat sink base on each of the at least two heat sinks. ### Claim 12 (depends on 8) The heat sink module of claim 8, wherein the mechanical support member comprises a planar member and a pair of engagement members at opposite ends of the planar member. ### Claim 13 (depends on 8) The heat sink module of claim 8, further comprising an electrical interconnect to provide a direct electrical link between the at least two processors. ### Claim 14 (depends on 1) The heat sink assembly of claim 1, wherein the mechanical support member is flexible, flexibility of the mechanical support member permitting independent vertical positioning of the first heat sink and the second heat sink relative to one another in correspondence with a difference in height between the first heat sink and the second heat sink. ### Claim 15 A heat sink assembly comprising: a first heat sink, formed to mate with a first processor along a first processor seating plane; a second heat sink, formed to mate with a second processor along a second processor seating plane; a mechanical support member to support the first heat sink and the second heat sink along the first processor seating plane and the second processor seating plane, respectively; and a flexible heat pipe between the first heat sink and the second heat sink to provide a thermal link therebetween, wherein each of the first and second heat sinks comprises a respective heat sink base, the heat sink base comprising: a first portion to make thermal contact with a corresponding one of the first and second processors, and a second portion extending past the first portion to engage with the mechanical support member. ### Claim 16 (depends on 15) The heat sink assembly of claim 15, wherein the mechanical support member comprises: a pair of end portions, each end portion extending under and attached to a corresponding one of the first and second heat sinks; and a middle portion between the end portions. ### Claim 17 (depends on 16) The heat sink assembly of claim 16, wherein each end portion of the mechanical support member has a vertical edge in contact with a vertical edge of the corresponding one of the first and second heat sinks. ### Claim 18 (depends on 16) The heat sink assembly of claim 16, wherein the first portion of each of the first and second heat sink bases opposes a corresponding one of the end portions of the mechanical support member. ### Claim 19 (depends on 15) The heat sink assembly of claim 15, wherein the first portion of each of the first and second heat sink bases is not in contact with the mechanical support member. ### Claim 20 (depends on 19) The heat sink assembly of claim 19, wherein the second portion of each of the first and second heat sink bases is not in contact with the corresponding one of the first and second processors.