# US 10,321,586 B1 · Modular solid-state storage system

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,321,586 B1
- Document ID: US10321586B1
- Status: Granted
- Kind: B1
- Application number: 14/981,671
- Filed: 2015-12-28
- Granted: 2019-06-11
- Earliest claimed: 2015-12-28
- Assignees: EMC IP Holding Company LLC
- Applicants: EMC Corporation
- Inventors: Jean-Philippe Fricker
- Web page: https://patentgrep.com/patent/US10321586B1

## CPC

- H05K 7/1418: {Card guides, e.g. grooves (H05K7/1425 takes precedence)}
- H05K 7/1424: {Card cages}
- H05K 7/20727: {within server blades for removing heat from heat source}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A system including a chassis and a hardware module bay disposed in a front portion of the chassis. The hardware module bay is configured to accommodate one or more horizontally oriented hardware modules. The one or more horizontally oriented hardware module are slidably insertable into the hardware module bay. The system further includes a main printed circuit board (PCB) that includes a chipset for communication with a hardware module inserted into the hardware module bay and a midplane disposed between the main PCB and the hardware module bay. The midplane is configured to electrically interface the hardware module inserted into the hardware module bay with the main PCB, upon insertion of the at least one horizontally oriented hardware module.

## Claims

### Claim 1

A system comprising:
a chassis;
a hardware module bay disposed in a front portion of the chassis,
wherein the hardware module bay is configured to accommodate at least a first horizontally oriented hardware module and a second horizontally oriented hardware module,
wherein the first horizontally oriented hardware module is slidably insertable into a center location of the hardware module bay,
wherein the second horizontally oriented hardware module is slidably insertable into one selected from a group consisting of a top location and a bottom location, of the hardware module bay;
a main printed circuit board (PCB) comprising a chipset for communication with a hardware module inserted into the hardware module bay; and
a midplane disposed between the main PCB and the hardware module bay,
wherein the midplane is configured to electrically interface at least the first and second horizontally oriented hardware modules, inserted into the hardware module bay, with the main PCB upon insertion of at least the first and second horizontally oriented hardware modules,
wherein the midplane comprises:
a center midplane PCB disposed coplanar to the first horizontally oriented hardware module; and
one selected from a group consisting of a top midplane PCB and a bottom midplane PCB, disposed coplanar to the second horizontally oriented hardware module,
wherein the center midplane PCB electrically interfaces with the main PCB through a first board-to-board connector and is configured to provide an electrical interface between the main PCB and the first horizontally oriented hardware module,
wherein the one selected from the group consisting of the top midplane PCB and the bottom midplane PCB, electrically interfaces with the center midplane PCB through a second board-to-board connector and is configured to provide an electrical interface between the center midplane PCB and the second horizontally oriented hardware module.

### Claim 2 (depends on 1)

The system of claim 1, wherein the chassis is a rack-mount chassis.

### Claim 3 (depends on 2)

The system of claim 2, wherein the rack-mount chassis is one rack unit high.

### Claim 4 (depends on 1)

The system of claim 1, wherein the midplane electrical interface comprises a power and a data interface.

### Claim 5 (depends on 1)

The system of claim 1 further comprising a fan module, wherein the fan module is disposed in a rear portion of the chassis.

### Claim 6 (depends on 5)

The system of claim 5,
wherein the hardware module bay is further configured to accommodate the at least one horizontally oriented hardware module such that gaps are provided above and below the at least one hardware module, and
wherein an airflow generated by the fan module passes along the upper and lower horizontal surfaces of the at least one hardware module, through the gaps.

### Claim 7 (depends on 1)

The system of claim 1, further comprising:
a power supply configured to power at least one selected from a group consisting of the first horizontally oriented hardware module and the second horizontally oriented hardware module.

### Claim 8 (depends on 1)

The system of claim 1, further comprising:
a hardware module bay disposed in a rear portion of the chassis.

### Claim 9 (depends on 8)

The system of claim 8 further comprising:
a removable front fan module, disposed in front of the hardware module bay disposed in the front portion of the chassis; and
a removable rear fan module disposed behind the hardware module bay disposed in the rear portion of the chassis.

### Claim 10 (depends on 9)

The system of claim 9, wherein the removable front fan module and the removable rear fan module redundantly generate an airflow through the chassis.