# US 10,321,579 B2 · Solder resist and printed wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,321,579 B2 - Document ID: US10321579B2 - Status: Granted - Kind: B2 - Application number: 15/657,510 - Filed: 2017-07-24 - Published: 2018-01-25 - Granted: 2019-06-11 - Earliest claimed: 2016-07-22 - Assignees: Ibiden Co., Ltd. - Applicants: Ibiden Co., Ltd. - Inventors: Yuji Ikawa - Web page: https://patentgrep.com/patent/US10321579B2 ## CPC - H05K 3/3452: Solder masks - H05K 3/243: {characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182)} - H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} - H05K 3/285: {Permanent coating compositions} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure - H05K 2201/0209: Inorganic, non-metallic particles - H05K 2201/10977: Encapsulated connections - H05K 2203/0577: Double layer of resist having the same pattern - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A solder resist includes a lower layer including a first resin and particles, and an upper layer including a second resin and formed on the lower layer. The particles are one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles. ## Claims ### Claim 1 A solder resist, comprising: a lower layer comprising a first resin and a plurality of particles; and an upper layer comprising a second resin and formed on the lower layer such that the upper layer has an upper surface that is a roughened surface, wherein the first resin of the lower layer includes a first epoxy resin, the second resin of the upper layer includes a second epoxy resin, the plurality of particles is one kind selected from a group of inorganic particles, the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles and has a thickness that is smaller than a thickness of the lower layer, and the first resin in the lower layer and the second resin in the upper layer are made such that the second resin has a curing temperature that is higher than a curing temperature of the first resin. ### Claim 2 (depends on 1) A solder resist according to claim 1, wherein the roughened surface of the upper layer has a roughness Ra in a range of 0.1 μm to 0.3 μm. ### Claim 3 (depends on 2) A solder resist according to claim 2, further comprising: a protective film formed on the upper surface of the upper layer such that the protective film has irregularities formed along the roughened surface of the upper layer. ### Claim 4 (depends on 2) A solder resist according to claim 2, wherein the first resin in the lower layer further includes a first polymer resin such that the first epoxy resin is a main component of the first resin, and the second resin in the upper layer further includes a second polymer resin such that the second epoxy resin is a main component of the second resin and that the second resin has the curing temperature that is higher than the curing temperature of the first resin. ### Claim 5 (depends on 1) A solder resist according to claim 1, wherein the upper layer has a thickness that is greater than an average particle size of the particles in the lower layer. ### Claim 6 (depends on 5) A solder resist according to claim 5, wherein the roughened surface of the upper layer has a roughness Ra in a range of 0.1 μm to 0.3 μm. ### Claim 7 (depends on 6) A solder resist according to claim 6, wherein the plurality of particles has a particle size in a range of 0.05 μm to 5.0 μm, and the upper layer is formed such that a ratio of the thickness of the upper layer to the thickness of the lower layer is in a range of 0.05 to 0.3. ### Claim 8 (depends on 1) A solder resist according to claim 1, wherein the first resin in the lower layer further includes a first polymer resin such that the first epoxy resin is a main component of the first resin, and the second resin in the upper layer further includes a second polymer resin such that the second epoxy resin is a main component of the second resin and that the second resin has the curing temperature that is higher than the curing temperature of the first resin. ### Claim 9 (depends on 1) A solder resist according to claim 1, wherein the group of inorganic particles comprises silica particles, alumina particles, aluminum nitride particles, and magnesium oxide particles. ### Claim 10 (depends on 1) A solder resist according to claim 1, wherein the plurality of particles has a particle size in a range of 0.05 μm to 5.0 μm. ### Claim 11 A printed wiring board, comprising: an outermost resin insulation layer; an outermost conductive layer formed on the outermost resin insulation layer; and a solder-resist layer formed on the outermost resin insulation layer and having a plurality of opening portions formed such that the opening portions are exposed portions of the outermost conductive layer, wherein the solder-resist layer comprises a lower layer comprising a first resin and a plurality of particles, and an upper layer comprising a second resin and formed on the lower layer such that the upper layer has an upper surface that is a roughened surface, the first resin of the lower layer includes a first epoxy resin, the second resin of the upper layer includes a second epoxy resin, the plurality of particles is one kind selected from a group of inorganic particles, the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles and has a thickness that is smaller than a thickness of the lower layer, and the solder-resist layer is made such that the second resin in the upper layer has a curing temperature that is higher than a curing temperature of the first resin in the lower layer. ### Claim 12 (depends on 11) A printed wiring board according to claim 11, wherein the roughened surface of the upper layer in the solder-resist layer has a roughness Ra in a range of 0.1 μm to 0.3 μm. ### Claim 13 (depends on 12) A printed wiring board according to claim 12, wherein the solder-resist layer comprises a protective film formed on the upper surface of the upper layer such that the protective film has irregularities formed along the roughened surface of the upper layer. ### Claim 14 (depends on 12) A printed wiring board according to claim 12, wherein the solder-resist layer is formed such that the first resin in the lower layer further includes a first polymer resin, that the first epoxy resin is a main component of the first resin, that the second resin in the upper layer further includes a second polymer resin, that the second epoxy resin is a main component of the second resin, and that the second resin has the curing temperature that is higher than the curing temperature of the first resin. ### Claim 15 (depends on 11) A printed wiring board according to claim 11, wherein the upper layer of the solder-resist layer has a thickness that is greater than an average particle size of the particles in the lower layer. ### Claim 16 (depends on 15) A printed wiring board according to claim 15, wherein the roughened surface of the upper layer in the solder-resist layer has a roughness Ra in a range of 0.1 μm to 0.3 μm. ### Claim 17 (depends on 16) A printed wiring board according to claim 16, wherein the plurality of particles has a particle size in a range of 0.05 μm to 5.0 μm, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles and has the thickness that is no greater than one half of a maximum particle size of the inorganic particles. ### Claim 18 (depends on 11) A printed wiring board according to claim 11, wherein the solder-resist layer is formed such that the first resin in the lower layer further includes a first polymer resin, that the first epoxy resin is a main component of the first resin, that the second resin in the upper layer further includes a second polymer resin, that the second epoxy resin is a main component of the second resin, and that the second resin has the curing temperature that is higher than the curing temperature of the first resin. ### Claim 19 (depends on 11) A printed wiring board according to claim 11, wherein the solder-resist layer is formed such that the group of inorganic particles comprises silica particles, alumina particles, aluminum nitride particles, and magnesium oxide particles. ### Claim 20 (depends on 11) A printed wiring board according to claim 11, wherein the solder-resist layer is formed such that the plurality of particles has a particle size in a range of 0.05 μm to 5.0 μm.