# US 10,321,572 B2 · Electronic package including cavity defined by resin and method of forming same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,321,572 B2 - Document ID: US10321572B2 - Status: Granted - Kind: B2 - Application number: 15/472,453 - Filed: 2017-03-29 - Published: 2017-10-05 - Granted: 2019-06-11 - Earliest claimed: 2016-04-01 - Assignees: Skyworks Filter Solutions Japan Co., Ltd. - Applicants: Skyworks Filter Solutions Japan Co., Ltd. - Inventors: Atsushi Takano; Mitsuhiro Furukawa; Ichiro Kameyama; Tetsuya Uebayashi - Web page: https://patentgrep.com/patent/US10321572B2 ## CPC - H05K 1/181: associated with surface mounted components - H03H 9/0523: {for flip-chip mounting} - H03H 9/059: {consisting of mounting pads or bumps} - H03H 9/1042: {the enclosure being defined by a housing formed by a cavity in a resin} - H03H 9/1085: {the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device} - H03H 9/17: having a single resonator (crystal tuning forks H03H9/21) - H03H 9/25: Constructional features of resonators using surface acoustic waves {(devices for manipulating acoustic surface waves in general G10K11/36)} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 3/303: with surface mounted components (H05K3/32 takes precedence) - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H05K 2201/10068: Non-printed resonator - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic component may include a substrate having a functional unit formed on a main surface of the substrate and a first resin layer formed on the main surface, the first resin layer having a first surface facing the main surface and a second surface opposed to the first surface, the first resin layer defining a cavity on the first surface enclosing the functional unit, the first resin layer defining a recess on the second surface, and a solder layer being formed in the recess so as not to exceed the second surface in a thickness direction. The functional unit may include a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion. The substrate may be formed of dielectric material. ## Claims ### Claim 1 An electronic component comprising: a substrate including a main surface; a functional unit formed on the main surface of the substrate; and a resin layer formed on the main surface of the substrate, the resin layer including a first surface facing the main surface of the substrate and a second surface opposed to the first surface, the resin layer defining a cavity on the first surface enclosing the functional unit, a portion of the first surface defining a wall of the cavity parallel to the main surface of the substrate, the resin layer including a recess on the second surface, and a solder layer disposed in the recess, the solder layer not exceeding the second surface in a thickness direction. ### Claim 2 (depends on 1) The electronic component of claim 1 wherein the functional unit includes one of a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion. ### Claim 3 (depends on 1) The electronic component of claim 1 wherein the substrate is formed of dielectric material. ### Claim 4 (depends on 1) The electronic component of claim 1 wherein the resin layer is provided with a through hole extending from the recess and passing through the resin layer to the main surface, a metal layer distinct from the solder layer being disposed in the through hole and electrically connecting the solder layer to the main surface. ### Claim 5 (depends on 1) The electronic component of claim 1 wherein a portion of the solder layer is disposed on the second surface of the resin layer in the recess. ### Claim 6 (depends on 1) The electronic component of claim 1 wherein a gap is provided between a periphery of the solder layer and a peripheral surface of the resin layer defining the recess. ### Claim 7 An electronic device comprising: an electronic component including a first substrate having a functional unit formed on a main surface of the first substrate and a first resin layer formed on the main surface thereof, the first resin layer having a first surface facing the main surface of the first substrate and a second surface opposed to the first surface, the first resin layer defining a cavity on the first surface enclosing the functional unit, a portion of the first surface defining a wall of the cavity parallel to the main surface of the first substrate, the first resin layer including a recess on the second surface, a through hole extending from the recess and passing through the resin layer to the main surface of the first substrate, a metal layer being disposed in the through hole; a second substrate having an electrode pad formed on a main surface thereof, a solder layer disposed in the recess in contact with the electrode pad, the solder layer, the metal layer, and the electrode pad having a combined thickness corresponding to a distance between the main surface of the first substrate and the main surface of the second substrate; and a second resin layer sealing the electronic component and the second substrate. ### Claim 8 (depends on 7) The electronic device of claim 7 wherein the functional unit includes one of a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion. ### Claim 9 (depends on 7) The electronic device of claim 7 wherein the first substrate is formed of dielectric material. ### Claim 10 (depends on 7) The electronic device of claim 7 wherein the first surface is in contact with the main surface of the first substrate. ### Claim 11 (depends on 7) The electronic device of claim 7 wherein the second surface is in contact with the main surface of the second substrate. ### Claim 12 (depends on 7) The electronic device of claim 7 wherein the second resin layer is in contact with the first substrate, the first resin layer, and the second substrate. ### Claim 13 (depends on 7) The electronic device of claim 7 wherein a portion of the first resin layer is disposed between the cavity and the second substrate, the second surface of the portion of the first resin layer being in direct contact with the main surface of the second substrate.