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US 10,321,571 B2Granted
Composite electronic component and board having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYu Jin Choi, Soo Hwan Son, Min Kyoung Cheon
Life of this patent
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Abstract
A composite electronic component includes a multilayer capacitor including external electrodes, a tantalum capacitor disposed adjacently to the multilayer capacitor, first electrode parts connected to the external electrodes, a second electrode part connected to a second body, and an encapsulant encapsulating the multilayer capacitor and the tantalum capacitor and formed such that portions of the first and second electrode parts are exposed.
Claims20
A composite electronic component, comprising:
- a multilayer capacitor including a first body and first and second external electrodes respectively disposed on first and second end surfaces of the first body;
- a tantalum capacitor including a second body and a tantalum wire exposed to a first end surface of the second body, and disposed adjacently to the multilayer capacitor;
- first electrode parts electrically connected to the first and second external electrodes of the multilayer capacitor;
- a second electrode part electrically connected to the second body of the tantalum capacitor;
- and
- an encapsulant encapsulating the multilayer capacitor and the tantalum capacitor,
- wherein the second electrode part connected to the tantalum capacitor has a composition different from the first electrode parts connected to the first and second external electrodes of the multilayer capacitor, and the encapsulant is disposed such that portions of each of the separate first and second electrode parts, connected to the multilayer capacitor and the tantalum capacitor respectively and having different respective compositions, are exposed externally from the encapsulant.
4 more elements
A board having a composite electronic component, comprising:
- a printed circuit board having electrode pads disposed thereon;
- the composite electronic component installed on the printed circuit board and including:
- a multilayer capacitor including a first body and first and second external electrodes respectively disposed on first and second end surfaces of the first body,
- a tantalum capacitor including a second body and a tantalum wire exposed to a first end surface of the second body, and disposed adjacently to the multilayer capacitor,
- first and second electrode parts respectively disposed on the first and second external electrodes of the multilayer capacitor,
- a third electrode part electrically connected to the second body of the tantalum capacitor, and
- an encapsulant encapsulating the multilayer capacitor and the tantalum capacitor,
- wherein the third electrode part connected to the tantalum capacitor is separate from the first and second electrode parts connected to the first and second external electrodes of the multilayer capacitor, and the encapsulant is disposed such that portions of each of the separate first, second, and third electrode parts, connected to the multilayer capacitor and the tantalum capacitor, and a portion of the tantalum wire are exposed externally from the encapsulant;
- and
- solders each contacting and connecting one of the exposed and separate first, second, and third electrode parts to and one of the electrode pads.
7 more elements
Dependencies are inferred from the claim text.