# US 10,321,570 B2 · Composite chip component, circuit assembly and electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,321,570 B2 - Document ID: US10321570B2 - Status: Granted - Kind: B2 - Application number: 14/781,964 - Filed: 2014-03-27 - Published: 2016-02-18 - Granted: 2019-06-11 - Earliest claimed: 2013-04-04 - Assignees: Rohm Co., Ltd. - Applicants: Rohm Co., Ltd. - Inventors: Hiroshi Tamagawa; Koichi Niino; Eiji Nukaga; Keishi Watanabe - Web page: https://patentgrep.com/patent/US10321570B2 ## CPC - H01G 4/228: Terminals - H01C 1/012: the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) - H01C 1/14: Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors - H01G 2/065: {for surface mounting, e.g. chip capacitors} - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 1/181: associated with surface mounted components - H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H05K 2201/10015: Non-printed capacitor - H05K 2201/10022: Non-printed resistor - H05K 2201/1003: Non-printed inductor - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H01C: RESISTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation. ## Claims ### Claim 1 A composite chip part comprising: a substrate having a front surface, a rear surface, and a side surface perpendicular to the front and rear surfaces, the substrate made of silicon; a plurality of chip elements arranged a distance apart from each other on the front surface of the substrate and having different functions; a protective layer formed on the front surface of the substrate and having a pair of openings; a pair of electrodes formed on only the front surface of the substrate in each of the plurality of chip elements such that each of the pair of electrodes protrudes upwardly from the protective layer and has a portion larger than each of the pair of openings in a plan view; an insulating film interposed between the pair of electrodes and the substrate such that the insulating film covers the side surface of the substrate; and a wiring film formed on the front surface of the substrate such that one electrode of the pair of electrodes is electrically connected to the wiring film, the wiring film having a taper shape in a sectional view, wherein the pair of electrodes are respectively arranged on one side of the front surface of the substrate and an opposite side of the front surface of the substrate opposite to each other, wherein the rear surface of the substrate is an exposed polishing surface, wherein the substrate is capable of being surface mounted on a mounting object via the pair of electrodes, and wherein a part of the wiring film covered by one electrode of the pair of electrodes is selectively exposed via a cut-out portion of a resin film, and another part of the wiring film is selectively covered by the resin film. ### Claim 2 (depends on 1) The composite chip part according to claim 1, wherein the insulating film is formed so as to cover a boundary region of the chip elements adjacent to each other on the front surface of the substrate. ### Claim 3 (depends on 1) The composite chip part according to claim 1, wherein the composite chip part is a pair chip part including a pair of the chip elements on the substrate, and the peripheral edge portion of the electrode is formed so as to cover four corner portions of the substrate. ### Claim 4 (depends on 1) The composite chip part according to claim 1, wherein the one electrode of the pair of electrodes is formed so as to protrude from a surface of the resin film. ### Claim 5 (depends on 4) The composite chip part according to claim 4, wherein the one electrode of the pair of electrodes includes a drawing portion drawn in a lateral direction along the surface of the resin film and selectively covering the surface of the resin film. ### Claim 6 (depends on 1) The composite chip part according to claim 1, wherein the one electrode of the pair of electrodes includes a Ni layer and an Au layer, and the Au layer is exposed. ### Claim 7 (depends on 6) The composite chip part according to claim 6, wherein the one electrode further includes a Pd layer interposed between the Ni layer and the Au layer. ### Claim 8 (depends on 1) The composite chip part according to claim 1, wherein the plurality of chip elements include a chip element of a 0402 size having a planar dimension of 0.4 mm×0.2 mm. ### Claim 9 (depends on 1) The composite chip part according to claim 1, wherein the plurality of chip elements include a chip element of a 03015 size having a planar dimension of 0.3 mm×0.15 mm. ### Claim 10 (depends on 1) The composite chip part according to claim 1, wherein the plurality of chip elements include a resistor including a resistor body connected between the pair of electrodes. ### Claim 11 (depends on 10) The composite chip part according to claim 10, wherein the resistor includes: a plurality of the resistor bodies; and a plurality of fuses provided on the substrate and connected to the one electrode of the pair of electrodes such that the plurality of resistor bodies can be individually separated. ### Claim 12 (depends on 1) The composite chip part according to claim 1, wherein the plurality of chip elements include a capacitor connected between the pair of electrodes. ### Claim 13 (depends on 12) The composite chip part according to claim 12, wherein the capacitor includes: a plurality of capacitor factors which form the capacitor; and a plurality of fuses provided on the substrate and connected to the one electrode of the pair of electrodes such that the plurality of capacitor factors can be individually separated. ### Claim 14 (depends on 1) A circuit assembly comprising: the composite chip part according to claim 1; and a mounting substrate including, on a mounting surface opposite the front surface of the substrate, a land joined by solder to the one electrode of the pair of electrodes. ### Claim 15 (depends on 14) An electronic device comprising: the circuit assembly according to claim 14; and a housing holding the circuit assembly. ### Claim 16 (depends on 1) The composite chip part according to claim 1, further comprising the insulating film interposed between the peripheral edge portion and the side surface of the substrate.