# US 10,321,569 B1 · Electronic module and method of making same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,321,569 B1 - Document ID: US10321569B1 - Status: Granted - Kind: B1 - Application number: 15/136,463 - Filed: 2016-04-22 - Granted: 2019-06-11 - Earliest claimed: 2015-04-29 - Assignees: VPT, Inc. - Applicants: VPT, Inc. - Inventors: Stephen J. Butler; Anthony G. Salamone - Web page: https://patentgrep.com/patent/US10321569B1 ## CPC - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 3/368: {parallel to each other (H05K3/361 takes precedence)} - H05K 9/0007: {Casings (standardised racks H05K9/0062)} - H05K 9/0045: {being rigid plastic containers having a coating of shielding material} - H05K 1/0224: {Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence)} - H05K 2201/0715: provided by an outer layer of PCB - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Electronic module with all-sided electromagnetic interference (EMI) shielding and methods of making same. The electronic module includes an encapsulated circuit board between a top plate and a conductive bottom plate, electrical leads extending from the circuit board through the bottom plate, and a continuous conductive coating substantially covering the entire electronic module except for a bottom surface of the bottom plate. The conductive coating forms direct, independent connections at least to the circuit board and the bottom plate. The conductive coating provides EMI shielding across the top and sides of the electronic module. The conductive bottom plate provides EMI shielding across the bottom of the electronic module. Methods of manufacturing include encapsulating a circuit board between a top plate and bottom plate, separating materials from the encapsulated circuit board to expose conductive traces on the circuit board and bottom plate, and coating the sawed device with a conductive coating. ## Claims ### Claim 1 An electronic module comprising: a top plate; a conductive bottom plate; a circuit board disposed between the top plate and the bottom plate; an encapsulant disposed between the top plate and the circuit board and between the bottom plate and the circuit board; an electrical lead forming a direct electrical connection with the circuit board and extending from the circuit board through the encapsulant and further through the bottom plate; and a continuous conductive coating surrounding the top plate, the circuit board, the encapsulant, and at least a portion of the bottom plate, the conductive coating forming a direct electrical connection with the circuit board and a direct electrical connection with the bottom plate, wherein the direct electrical connection of the conductive coating with the circuit board is independent of the direct electrical connection of the conductive coating with the bottom plate and any direct electrical connection of the conductive coating with the electrical lead, and wherein the direct electrical connection of the conductive coating with the bottom plate is independent of the direct electrical connection of the conductive coating with the circuit board and any direct electrical connection of the conductive coating with the electrical lead. ### Claim 2 (depends on 1) The module of claim 1, wherein the conductive coating is in direct electrical connection with the circuit board via a conductive trace of the circuit board. ### Claim 3 (depends on 1) The module of claim 1, wherein the conductive coating is in direct electrical connection with the bottom plate via a metalized portion of the bottom plate. ### Claim 4 (depends on 1) The module of claim 1, wherein the encapsulant disposed between the top plate and the circuit board and between the bottom plate and the circuit board is a single, solid piece of encapsulant. ### Claim 5 (depends on 1) The module of claim 1, wherein: the circuit board comprises a substrate comprising a top side and a bottom side; the top side of the substrate is disposed between the bottom side of the circuit board and the top plate; the bottom side of the circuit board is disposed between the top side of the circuit board and the bottom plate; and the circuit board comprises at least one electrical component spanning the substrate from beyond the top side of the substrate to beyond the bottom side of the substrate. ### Claim 6 (depends on 1) The module of claim 1, wherein: the circuit board comprises a substrate comprising a top side and a bottom side; the top side of the substrate is disposed between the bottom side of the circuit board and the top plate; the bottom side of the circuit board is disposed between the top side of the circuit board and the bottom plate; and the circuit board comprises at least one electrical component on the top side of the substrate and at least one electrical component on the bottom side of the substrate. ### Claim 7 (depends on 1) The module of claim 1, wherein the bottom plate comprises a conductive portion and a non-conductive portion. ### Claim 8 (depends on 7) The module of claim 7, wherein the conductive portion of the bottom plate is in electrical connection with the conductive coating. ### Claim 9 (depends on 7) The module of claim 7, wherein the conductive portion comprises metal disposed on a top side of the non-conductive portion and metal disposed on a bottom side of the nonconductive portion, wherein the top side of the non-conductive portion is disposed between the bottom side of the non-conductive portion and the circuit board. ### Claim 10 (depends on 9) The module of claim 9, wherein the conductive portion comprises a conductive via spanning from the metal disposed on the top side of the non-conductive portion and the metal disposed on the bottom side of the non-conductive portion.