# US 10,321,567 B2 · Method for producing electronic components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,321,567 B2 - Document ID: US10321567B2 - Status: Granted - Kind: B2 - Application number: 15/328,144 - Filed: 2015-05-13 - Published: 2017-08-03 - Granted: 2019-06-11 - Earliest claimed: 2014-07-24 - Assignees: Hamamatsu Photonics K.K. - Applicants: Hamamatsu Photonics K.K. - Inventors: Katsuya Ishikawa; Toshiyuki Kakihara; Takashi Masuda - Web page: https://patentgrep.com/patent/US10321567B2 ## CPC - H05K 1/145: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 3/0052: {Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards} - H05K 3/0097: {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/301: {by means of a mounting structure (H05K3/325 takes precedence)} - H05K 3/368: {parallel to each other (H05K3/361 takes precedence)} - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/0909: Preformed cutting or breaking line - H05K 2203/1316: Moulded encapsulation of mounted components - H05K 2203/1327: Moulding over PCB locally or completely - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Through the use of a method of producing electronic components, a plurality of electronic components are obtained by cutting, along a predetermined cutting line, a laminate including a first circuit board and a second circuit board both mounted with circuit components. The method of producing electronic components includes: a stacking step of stacking the second circuit board on the first circuit board with a spacer interposed therewith, the first circuit board being provided with a filled via around a mounting region of the circuit components; a filling step of filling a filling space formed between the first circuit board and the second circuit board using the spacer with insulating resins; and a cutting step of cutting the laminate along the cutting line, the cutting line dividing the filled via, and exposing the filled via from a cut surface to acquire terminal portions of the electronic components. ## Claims ### Claim 1 A method of producing electronic components for acquiring a plurality of electronic components by cutting, along a predetermined cutting line, a laminate including a first circuit board and a second circuit board both mounted with circuit components, the method comprising: a stacking step of stacking the second circuit board on the first circuit board with a spacer interposed therebetween, the first circuit board being provided with a filled via around a mounting region of the circuit components of the first circuit board thus forming the laminate; a filling step of filling a filling space formed between the first circuit board and the second circuit board using the spacer with an insulating resin; and a cutting step of cutting the laminate along the cutting line, the cutting line dividing the filled via, and exposing the filled via from a cut surface to acquire terminal portions of the electronic components, wherein the filling space formed between the first circuit board and the second circuit board includes a first filling space formed inside the mounting region, wherein the filling space formed between the first circuit board and the second circuit board further includes a second filling space formed outside the mounting region and communicating with the first filling space, the first filling space and the second filling space are partitioned by the spacer, the spacer has a communication opening communicating the first filling space with the second filling space, and the communication opening is filled with the insulating resin in the filling step. ### Claim 2 (depends on 1) The method for producing electronic components according to claim 1, wherein the stacking step includes stacking a third circuit board on the second circuit board with a second spacer interposed therebetween, and the filling step includes filling a different filling space formed between the second circuit board and the third circuit board using the second spacer with an insulating resin. ### Claim 3 (depends on 2) The method for producing electronic components according to claim 2, wherein the filling space formed between the first circuit board and the second circuit board includes the first filling space formed inside the mounting region and the second filling space formed outside the mounting region and communicating with the first filling space, the different filling space formed between the second circuit board and the third circuit board includes a third filling space formed outside the mounting region, and the second circuit board includes a communication hole letting the second filling space and the third filling space to communicate with each other, wherein the communication hole is filled with the insulating resin in the filling step. ### Claim 4 (depends on 1) The method for producing electronic components according to claim 1, wherein the insulating resin in the communication opening is cut in the cutting step and exposed from the cut surface so that the cutting line divides the communication opening. ### Claim 5 (depends on 1) The method for producing electronic components according to claim 1, wherein at least a part of the insulating resin filled in the second filling space is removed when cutting the laminate along the cutting line in the cutting step.