# US 10,321,566 B2 · Printed wiring board and method of manufacturing the same

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- Number: US 10,321,566 B2
- Document ID: US10321566B2
- Status: Granted
- Kind: B2
- Application number: 15/683,138
- Filed: 2017-08-22
- Published: 2017-12-07
- Granted: 2019-06-11
- Earliest claimed: 2015-02-23
- Assignees: Toppan Printing Co., Ltd.
- Applicants: Toppan Printing Co., Ltd.
- Inventors: Yasuyuki Hitsuoka
- Web page: https://patentgrep.com/patent/US10321566B2

## CPC

- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 3/0032: {of organic insulating material}
- H05K 3/423: {characterised by electroplating method}
- H05K 3/425: {characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern}
- H05K 3/426: {initial plating of through-holes in substrates without metal}
- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 3/0035: {of blind holes, i.e. having a metal layer at the bottom}
- H05K 3/427: {initial plating of through-holes in metal-clad substrates}
- H05K 2201/09827: Tapered, e.g. tapered hole, via or groove
- H05K 2201/09854: Hole or via having special cross-section, e.g. elliptical
- H05K 2203/107: Using laser light
- H05K 2203/1572: Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A printed wiring board according to an aspect of the present invention includes an insulating resin, a plated copper formed on a front surface side of the insulating resin, and a plated copper formed on a back surface side of the insulating resin. The plated copper and the plated copper are electrically connected via a plated copper that fills a through hole penetrating the insulating resin from the front surface side to the back surface side. Furthermore, the through hole includes a conical section whose opening diameter decreases from the front surface side to the back surface side of the insulating resin, and a cylindrical section that communicates with the conical section at a bottom surface of the conical section.

## Claims

### Claim 1

A printed wiring board, comprising: an insulating layer; a first conductive layer formed on one surface side of the insulating layer; and a second conductive layer formed on another surface side of the insulating layer; wherein the first and second conductive layers are electrically connected via a conductor that fills a through hole penetrating the insulating layer from the one surface side to the another surface; wherein the through hole includes a tapered section whose opening diameter decreases from the one surface to the another surface of the insulating layer, the tapered section having a minimum opening diameter section, and includes a cylindrical section that communicates with the tapered section at the minimum opening diameter section and intersects with the another surface, wherein a thickness of at least part of the conductor varies in accordance with a decrease in opening diameter of the tapered section, wherein an opening of the cylindrical section has a smaller radius of curvature than an opening of the tapered section, wherein the cylindrical section overlaps at least a portion of the tapered section and is structured such that at least part of the conductor is positioned between opposing curved portions of the respective openings of the tapered section and the cylindrical section, which respectively coincide with the one surface and the another surface of the insulating layer, and wherein the conductor has a first recess extended further from the another surface than a second recess extended from the one surface.

### Claim 2 (depends on 1)

The printed wiring board according to claim 1,
wherein a portion of the insulating layer where the through hole is formed has a thickness in a range of 60 μm or more to 200 μm or less.

### Claim 3 (depends on 1)

The printed wiring board of claim 1, wherein
the cylindrical section has an opening diameter in a range of 30 μm or more to 60 μm or less;
the cylindrical section has a length in a thickness direction of the insulating layer in a range of 30 μm or more to 60 μm or less; and,
the cylindrical section has an aspect ratio of the length to the opening diameter of 1 or less.

### Claim 4 (depends on 1)

A method of manufacturing the printed wiring board of claim 1, comprising the steps of:
forming the through hole by laser beam machining; and
then filling the through hole using plating to make the first and second conductive layers electrically connected.

### Claim 5 (depends on 4)

The method of manufacturing the printed wiring board of claim 4,
wherein the step of forming the through hole includes irradiating the insulating layer with a first laser beam from the one surface of the insulating layer to form the tapered section, and irradiating a bottom surface of the tapered section with a second laser beam from the one surface of the insulating layer to form the cylindrical section.

### Claim 6 (depends on 5)

The method of manufacturing the printed wiring board of claim 5,
wherein the step of forming the through hole includes, before irradiating the insulating layer with the first laser beam, forming a metal foil in a region of the one surface of the insulating layer, except for a region to be irradiated with the first laser beam.

### Claim 7 (depends on 1)

The printed wiring board of claim 1, wherein: in the tapered section, the opening diameter decreases from the one surface to the another surface of the insulating layer in a thickness direction of the insulating layer, and in the cylindrical section, an opening diameter of the opening increases in a direction from the one surface to the another surface, such a thickness of a second part of the conductor decreases in the direction from the one surface to the another surface.

### Claim 8 (depends on 1)

The printed wiring board of claim 1, wherein the tapered section is formed as a conical section.

### Claim 9 (depends on 1)

The printed wiring board of claim 1, wherein in a direction orthogonal to the thickness direction of the insulating layer, (i) a distance from a first end side of the part of the conductor positioned between the opposed curved portions to a second end side of the part of the conductor is smaller than (ii) a distance from a first end side of part of the conductor at a maximum opening diameter section of the tapered section to a second end side of the part of the conductor at a maximum opening diameter section.