# US 10,321,561 B2 · Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,321,561 B2
- Document ID: US10321561B2
- Status: Granted
- Kind: B2
- Application number: 15/643,121
- Filed: 2017-07-06
- Published: 2018-05-17
- Granted: 2019-06-11
- Earliest claimed: 2016-11-15
- Assignees: Avary Holding (Shenzhen) Co., Limited.; HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Applicants: Avary Holding (Shenzhen) Co., Limited.; HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- Inventors: Xian-Qin Hu; Ming-Jaan Ho
- Web page: https://patentgrep.com/patent/US10321561B2

## CPC

- H05K 1/0281: {Reinforcement details thereof}
- H05K 1/112: {directly combined with via connections}
- H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions}
- H05K 1/144: {Stacked arrangements of planar printed circuit boards}
- H05K 1/181: associated with surface mounted components
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/22: Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)}
- H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)}
- H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/116: {Lands, clearance holes or other lay-out details concerning the surrounding of a via}
- H05K 3/244: {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)}
- H05K 3/428: {initial plating of through-holes in substrates having a metal pattern}
- H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between
- H05K 2201/09054: Raised area or protrusion of metal substrate
- H05K 2201/09454: Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
- H05K 2201/09509: Blind vias, i.e. vias having one side closed
- H05K 2201/097: Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
- H05K 2201/09709: Staggered pads, lands or terminals; Parallel conductors in different planes
- H05K 2201/09827: Tapered, e.g. tapered hole, via or groove
- H05K 2201/10689: Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
- H05K 2201/2009: Reinforced areas, e.g. for a specific part of a flexible printed circuit
- Y10T 29/49165: by forming conductive walled aperture in base
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.

## Claims

### Claim 1

A flexible printed circuit board, comprising:
a first conductive pattern layer, the first conductive pattern layer comprising a plurality of first conductive pads;
a second conductive pattern layer, the second conductive pattern layer comprising a plurality of second conductive pads;
a plurality of first through holes being defined through the flexible printed circuit board, each of the plurality of first through holes corresponding to and being defined through one first conductive pad;
a plurality of second through holes being defined through the flexible printed circuit board, each of the plurality of second through holes corresponding to and being defined through one second conductive pad;
a plurality of first conductive pillars, each of the plurality of first conductive pillars corresponding to and being received in one first through hole to electrically connect to one first conductive pad, the plurality of first conductive pillars being spaced from the second conductive pattern layer, and
a plurality of second conductive pillars, each of the plurality of second conductive pillars corresponding to and being received in one second through hole to electrically connect to one second conductive pad, the plurality of second conductive pillars being spaced from the first conductive pattern layer;
wherein the plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads, a plurality of first grooves and a plurality of second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the plurality of first grooves is aligned with and corresponds to one first conductive pillar, and each of the plurality of second grooves is aligned with and corresponds to one second conductive pillar.

### Claim 2 (depends on 1)

The flexible printed circuit board of claim 1, wherein one exposed end of each of the plurality of first conductive pillars and one exposed end of each of the plurality of second conductive pillars protrude from one side of the flexible printed circuit board.

### Claim 3 (depends on 1)

The flexible printed circuit board of claim 1, wherein a diameter of each of the plurality of first conductive pillars and a diameter of each of the plurality of second conductive pillars decrease along a direction from one side of the flexible printed circuit board to an opposite side of the flexible printed circuit board.

### Claim 4 (depends on 1)

The flexible printed circuit board of claim 1, wherein a stiffener is adhered on a side of the flexible printed circuit board, to cover one end of each first conductive pillars and one end of each second conductive pillars.

### Claim 5 (depends on 1)

The flexible printed circuit board of claim 1, wherein an insulating radiating material is infilled into the plurality of first grooves and the plurality of second grooves, and a stiffener is adhered on the surface of the flexible printed circuit board to cover the insulating radiating material.

### Claim 6 (depends on 1)

The flexible printed circuit board of claim 1, wherein a plurality of third grooves are defined from the surface of the second conductive pattern layer away from the first conductive pattern layer to a surface of the first conductive pattern layer near the second conductive pattern layer, each of the plurality of third grooves corresponds to and is in air communication with one of the plurality of first grooves.

### Claim 7 (depends on 6)

The flexible printed circuit board of claim 6, wherein an insulating radiating material is infilled into the plurality of first grooves, the plurality of second grooves and the plurality of third grooves, and then a stiffener is adhered on the surface of the flexible printed circuit board to cover the insulating radiating material.

### Claim 8

A printed circuit board structure, comprising:
a flexible printed circuit board, comprising:
a first conductive pattern layer, the first conductive pattern layer comprising a plurality of first conductive pads;
a second conductive pattern layer, the second conductive pattern layer comprising a plurality of second conductive pads;
a plurality of first through holes being defined through the flexible printed circuit board, each of the plurality of first through holes corresponding to and being defined through one first conductive pad;
a plurality of second through holes being defined through the flexible printed circuit board, each of the plurality of second through holes corresponding to and being defined through one second conductive pad;
a plurality of first conductive pillars, each of the plurality of first conductive pillars corresponding to and being received in one first through hole to electrically connect to one first conductive pad, the plurality of first conductive pillars being spaced from the second conductive pattern layer, and
a plurality of second conductive pillars, each of the plurality of second conductive pillars corresponding to and being received in one second through hole to electrically connect to one second conductive pad, the plurality of second conductive pillars being spaced from the first conductive pattern layer;
wherein the plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads, a plurality of first grooves and a plurality of second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the plurality of first grooves is aligned with and corresponds to one first conductive pillar, and each of the plurality of second grooves is aligned with and corresponds to one second conductive pillar; and
at least one electronic component mounted on the plurality of electrical contact pads.

### Claim 9 (depends on 8)

The printed circuit board structure of claim 8, wherein one exposed end of each of the plurality of first conductive pillars and one exposed end of each of the plurality of second conductive pillars protrude from one side of the flexible printed circuit board.

### Claim 10 (depends on 8)

The printed circuit board structure of claim 8, wherein a diameter of each of the plurality of first conductive pillars and a diameter of each of the plurality of second conductive pillars decrease along a direction from one side of the flexible printed circuit board to an opposite side of the flexible printed circuit board.

### Claim 11 (depends on 8)

The printed circuit board structure of claim 8, further comprising at least one connecting circuit board, and the flexible printed circuit board further comprising a plurality of conductive fingers; wherein the at least one connecting circuit board is adhered on and electrically connects to the plurality of conductive fingers by at least one anisotropic conductive film.