# US 10,321,559 B2 · Display device and method for detecting bonding condition in bonding area of display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,321,559 B2 - Document ID: US10321559B2 - Status: Granted - Kind: B2 - Application number: 15/214,368 - Filed: 2016-07-19 - Published: 2017-07-06 - Granted: 2019-06-11 - Earliest claimed: 2016-01-04 - Assignees: Boe Technology Group Co., Ltd. - Applicants: Boe Technology Group Co., Ltd. - Inventors: Song Meng; Danna Song - Web page: https://patentgrep.com/patent/US10321559B2 ## CPC - H05K 1/0268: {for electrical inspection or testing} - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 1/181: associated with surface mounted components - H05K 3/361: {Assembling flexible printed circuits with other printed circuits} - H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions} - H05K 2201/10128: Display - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The display device comprises a printed circuit board, a display panel and a chip on film for connecting the printed circuit board with the display panel. The chip on film comprises a plurality of output pads and a plurality of first test pads which are close to the plurality of output pads and arranged at intervals. The display panel comprises a plurality of input pads in one-to-one correspondence with the plurality of output pads of the chip on film, and a plurality of second test pads which are close to the plurality of input pads of the display panel and arranged at intervals. A gap between two adjacent first test pads of the chip on film overlaps a second test pad of the display panel such that the two adjacent first test pads of the chip on film are connected via the second test pad of the display panel. ## Claims ### Claim 1 A display device comprising a printed circuit board, a display panel and a chip on film for connecting the printed circuit board with the display panel, the chip on film comprising a plurality of output pads, the display panel comprising a plurality of input pads, each one of the plurality of input pads corresponding to and coupled with a respective output pad of the plurality of output pads, wherein the chip on film further comprises a plurality of first test pads which are spaced from the plurality of output pads of the chip on film and arranged at intervals, the display panel further comprises a plurality of second test pads which are spaced from the plurality of input pads of the display panel and arranged at intervals, wherein a gap between every two adjacent first test pads of the plurality of first test pads of the chip on film overlaps a respective second test pad of the display panel such that all of the plurality of first test pads of the chip on film are connected via the second test pads of the display panel. ### Claim 2 (depends on 1) The device according to claim 1, wherein the gap between two adjacent first test pads of the plurality of first test pads of the chip on film has a length smaller than a length of the second test pad of the display panel which overlaps the gap. ### Claim 3 (depends on 2) The device according to claim 2, wherein the plurality of first test pads or the plurality of second test pads are located on a same line. ### Claim 4 (depends on 3) The device according to claim 3, wherein the chip on film further comprises a plurality of first test lines, which are connected to at least some of the plurality of first test pads of the chip on film, respectively. ### Claim 5 (depends on 4) The device according to claim 4, wherein the printed circuit board comprises a plurality of second test lines in one-to-one correspondence with the first test lines of the chip on film. ### Claim 6 (depends on 5) The device according to claim 5, wherein the printed circuit board further comprises a plurality of test points in one-to-one correspondence with and connected to the second test lines of the printed circuit board. ### Claim 7 (depends on 1) The device according to claim 1, wherein the second test pads of the display panel are located between a display area and the input pads of the display panel. ### Claim 8 (depends on 1) A method for detecting a bonding condition in a bonding area of a display device as defined in claim 1, wherein the method comprises: connecting the display panel with the printed circuit board via the chip on film; determining whether there is poor bonding in the bonding area for the chip on film and the display panel by means of the first test pads of the chip on film and the second test pads of the display panel. ### Claim 9 (depends on 8) The method according to claim 8, wherein the gap between two adjacent first test pads of the chip on film has a length smaller than a length of the second test pad of the display panel which overlaps the gap. ### Claim 10 (depends on 9) The method according to claim 9, wherein the plurality of first test pads or the plurality of second test pads are located on a same line. ### Claim 11 (depends on 10) The method according to claim 10, wherein the chip on film further comprises a plurality of first test lines, the first test lines being connected to the first test pads of the chip on film. ### Claim 12 (depends on 11) The method according to claim 11, wherein the printed circuit board comprises a plurality of second test lines in one-to-one correspondence with the first test lines of the chip on film. ### Claim 13 (depends on 12) The method according to claim 12, wherein the printed circuit board further comprises a plurality of test points in one-to-one correspondence with and connected to the second test lines of the printed circuit board. ### Claim 14 (depends on 8) The method according to claim 8, wherein the second test pads of the display panel are located between a display area and the input pads of the display panel.