# US 10,321,558 B2 · Printed circuit board

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- Number: US 10,321,558 B2
- Document ID: US10321558B2
- Status: Granted
- Kind: B2
- Application number: 14/971,688
- Filed: 2015-12-16
- Published: 2016-04-14
- Granted: 2019-06-11
- Earliest claimed: 2010-09-17
- Assignees: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicants: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Inventors: Nikolai Haslebner; Markus Leitgeb; Michael Goessler; Mike Morianz
- Web page: https://patentgrep.com/patent/US10321558B2

## CPC

- H05K 1/0266: {Marks, test patterns or identification means}
- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H05K 1/0298: {Multilayer circuits}
- H05K 1/11: Printed elements for providing electric connections to or between printed circuits
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00)
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/36: Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)}
- H05K 3/4688: {Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602)}
- H05K 1/0269: {for visual or optical inspection}
- H05K 3/4638: {Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits}
- H05K 2201/0355: Metal foils
- H05K 2201/058: Direct connection between two or more FPCs or between flexible parts of rigid PCBs
- H05K 2201/09918: Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
- H05K 2201/09936: Marks, inscriptions, etc. for information
- H05K 2203/166: Alignment or registration; Control of registration
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- Y10T 29/49126: Assembling bases
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A circuit board includes a plurality of circuit board areas, wherein the individual circuit board areas include at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

## Claims

### Claim 1

A circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an insulating base material and a conducting or conductive pattern located on or in the base material, comprising:
a substrate material,
at least one registration mark formed within and through the substrate material,
a first circuit board area arranged on the substrate material, said first circuit board area being oriented relative to the registration mark, and
a plurality of connections of the conducting or conductive patterns of the first circuit board area to the conducting or conductive patterns of at least one additional circuit board area,
wherein the circuit board additionally comprises:
the at least one additional circuit board area being arranged on the same or common surface of the substrate material as the first circuit board area, being adjoining or at least partially overlapping the first circuit board area, and being oriented relative to the registration mark; and
wherein further layers of a multilayer circuit board are arranged on the circuit board areas disposed on the substrate material and the further layers have substantially identical heights;
wherein at least one electronic component is additionally arranged on the substrate material, and embedded in the at least one additional circuit board area, and contactable with at least one conducting or conductive pattern, said component being orientable relative to the at least one registration mark.

### Claim 2 (depends on 1)

The circuit board according to claim 1, wherein at least the first circuit board area is fixed to the substrate material via an interposed adhesive.

### Claim 3 (depends on 1)

The circuit board according to claim 1, wherein the substrate material is formed by a conducting film.

### Claim 4 (depends on 1)

The circuit board according to claim 1, wherein the connections between the conducting or conductive patterns of the individual circuit board areas are formed by passage openings filled with conductive material.

### Claim 5 (depends on 1)

The circuit board according to claim 1, wherein the first circuit board area is comprised of a flexible circuit board area and the at least one additional circuit board area is comprised of a rigid circuit board area.