# US 10,321,555 B1 · Printed circuit board based RF circuit module

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- Number: US 10,321,555 B1
- Document ID: US10321555B1
- Status: Granted
- Kind: B1
- Application number: 16/121,007
- Filed: 2018-09-04
- Granted: 2019-06-11
- Earliest claimed: 2018-09-04
- Assignees: Raytheon Company
- Applicants: Raytheon Company
- Inventors: Susan C. Trulli; Christopher M. Laighton; Elicia K. Harper
- Web page: https://patentgrep.com/patent/US10321555B1

## CPC

- H05K 1/0219: {Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors}
- H01P 3/081: {Microstriplines}
- H05K 1/0243: {Printed circuits associated with mounted high frequency components}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)}
- H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs
- H05K 3/34: by soldering
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting}
- H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors}
- H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)}
- H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
- H05K 2201/0723: provided by an inner layer of PCB
- H05K 2201/09036: Recesses or grooves in insulating substrate
- H05K 2201/0919: Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
- H05K 2201/093: Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
- H05K 2201/10659: Different types of terminals for the same component, e.g. solder balls combined with leads
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- H05K 2203/049: Wire bonding
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An RF circuit module having RF and DC contacts on a surface of a circuit board. An RF component having RF and DC contacts is disposed in a cavity of the circuit board. Electrical connectors bridge the cavity to connect the RF contacts on the circuit board to the RF contacts on the RE component and the DC, contacts on the circuit board to the DC contacts on the RF component. A plug member is disposed in the cavity which has a dielectric member with an outer portion disposed over the RF and DC contacts on the circuit board and an inner portion elevated above the RF and DC contacts the RF component. The plug member has one portion of electrical conductors disposed on an upper surface of the inner portion and another portion disposed under the outer portion on, and electrically connected to, the DC contacts on the circuit board.

## Claims

### Claim 1

An RF circuit module, comprising:
a circuit board having RF and DC contacts on a surface of the circuit board, the circuit board having a cavity therein;
an RF component having RF and DC contacts disposed in the cavity of the circuit board;
a plurality of electrical connectors bridge the cavity to connect the RF contacts on the circuit board to the RF contacts on the RF component and the DC contacts on the circuit board to the DC contacts on the RF component; and
a plug member, disposed in the cavity, the plug member comprising: a dielectric member with an outer portion disposed over the RF and DC contacts on the circuit board; an inner portion elevated above the RF and DC contacts of the RF component; and one portion of electrical conductors disposed on an upper surface of the inner portion and another portion disposed under the outer portion on, and electrically connected to, the DC contacts on the circuit board.

### Claim 2 (depends on 1)

The RF circuit module recited in claim 1 wherein the circuit board includes a conductive layer patterned on the surface to provide portions of microwave transmission lines for coupling RF energy to, and from, the RF component, portions of the patterned layer closer to the cavity providing strip conductors for microstrip transmission lines portions of the microwave transmission lines and other portions of the patterned layer further away from the cavity providing strip conductors for stripline transmission lines portions of the microwave transmission lines.

### Claim 3 (depends on 2)

The RF circuit module recited in claim 2 including a ground plane board having a dielectric member and a conductive layer, the conductive layer being disposed on a bottom surface of the dielectric member, the conductive layer being disposed on portions of a conductive layer on the circuit board.

### Claim 4 (depends on 2)

The RF circuit module recited in claim 2 wherein the ground plane board has a cavity therein exposing the RF and DC contacts of the circuit board and for receiving the plug member, portions of the conductive layer of the ground plane board being disposed over the strip conductors provide an upper ground plane conductor for the stripline transmission lines.

### Claim 5 (depends on 4)

The RF circuit module recited in claim 4 including a shielding layer disposed, and electrically connected to: the conductive layer of the ground plane board; and, the portion of electrical conductors disposed on the upper surface of the inner portion of the plug member.

### Claim 6 (depends on 5)

The RF circuit module recited in claim 5 including a component supporting board having a dielectric member and a conductive layer on the bottom of the dielectric member, the electrically conductive layer of the component supporting board being disposed on, and electrically connected to: the conductive layer of the ground plane board; and, the portion of electrical conductors disposed on the upper surface of the inner portion of the plug member.

### Claim 7

A structure, comprising:
(A) a support;
(B) a circuit board having a lower cavity therein exposing a portion of a surface of the support, the circuit board comprising:
(a) a microwave transmission line having an RF contact pad on an upper surface of the circuit board;
(b) a DC contact pad on the upper surface of the circuit board;
(C) an RF component disposed in the lower cavity on the exposed portion of the surface of the support, the RF component having an RF contact pad on an upper surface of the RF component and a DC contact pad on the upper surface of the RF component;
(D) a first electrical connector bridging the lower cavity having one end connected to the RF contact pad on the upper surface of the RF component and another end connected to the RF contact pad on the upper surface of the circuit board;
(E) a second electrical connector bridging the lower cavity having one end connected to the DC contact pad on the upper surface of the RF component and another end connected to the DC contact pad on the upper surface of the circuit board;
(F) a dielectric board having an electrically conductive upper surface and a bottom surface disposed on the upper surface of the circuit board, the dielectric board having an upper cavity in registration with the lower cavity, the upper cavity being wider than the lower cavity, the upper cavity exposing: the RF contact of the RF component; the DC contact pad of the RF component; the RF contact pad on the upper surface of the circuit board; the DC component on the upper surface of the circuit board; the first electrical connector; and the second electrical connector;
(G) a plug member, disposed in the upper cavity, comprising: a dielectric support; and, an electrical conductor having a first portion disposed on a top surface of the dielectric support connected to the electrically conductive upper surface of the dielectric board and a second portion disposed on a bottom surface of the dielectric support, the second portion of the electrical conductor being disposed on the DC contact pad on the surface of the circuit board.

### Claim 8 (depends on 7)

The structure recited in claim 7 wherein the electrically conductive upper surface of the dielectric board has an aperture therein; and wherein the aperture exposes an underlying portion of the upper surface of the dielectric board and including an additional DC contact disposed on the exposed portion cif the upper surface of the dielectric board; and wherein the additional DC contact is electrically connected to the electrical conductor on the top surface of the dielectric support of the plug member.

### Claim 9 (depends on 8)

The structure recited in claim 8 wherein the additional DC contact is electrically connected to the electrical conductor on the top surface of the dielectric support of the plug member by an electrical contact passing over the upper cavity.

### Claim 10

A structure for connecting RF and DC energy to an RF component, comprising:
(A) a support;
(B) a circuit board, having a cavity therein exposing a portion of a surface of the support, comprising:
(a) a stripline transmission line section comprising: a center strip conductor separated from: a lower ground plane conductor by a lower dielectric and an upper ground plane conductor by an upper dielectric; and
(b) a DC contact pad disposed on a first portion of the surface of the lower dielectric;
(c) an RF contact pad disposed on a first portion of the surface of the lower dielectric;
(d) a microstrip transmission line section having:
(i) one end connected to a strip conductor connected to the center strip conductor of the stripline transmission line section and a second end connected to the RF contact pad;
(ii) wherein the strip conductor of the microstrip transmission line section is disposed on the upper surface of the lower dielectric and separated from the lower ground plane conductor by the lower dielectric; and
(e) wherein a lower portion of the cavity is formed in the lower dielectric and an upper, wider portion of the cavity is formed in the upper dielectric;
(C) an RF component disposed in the lower portion of the cavity and disposed on the exposed portion of the surface the support, the RF component having an RF contact pad for RF energy and a DC contact pad for DC energy, wherein the RF contact pad of the RF component is connected to the RF contact pad of the circuit board; and
(D) a plug member, disposed in the upper portion of the cavity, comprising: a dielectric support; and, an electrical conductor having a first portion disposed on a top surface of the dielectric support and a second portion disposed on a bottom surface of the dielectric support, the second portion of the electrical conductor being disposed on the DC contact pad of the circuit hoard.

### Claim 11 (depends on 10)

The structure recited in claim 10 including an electrically conductive member disposed on and electrically connected to: the upper ground plane conductor and the portion of the electrical conductor disposed on the top surface of the dielectric support of the plug member.

### Claim 12

A structure, comprising:
a support;
a circuit board having a lower cavity therein exposing a portion of a surface of the support, the circuit board comprising:
a microwave transmission line having an RF contact pad on an upper surface of the lower circuit board;
a plurality of DC contact pads on the upper surface of the lower circuit board; a plurality of RF contact pads on the upper surface of the lower circuit board;
an RF component disposed in the cavity on the exposed portion of the surface of the support, the RF component having a plurality of RF contact pads on an upper surface of the RF component and a plurality of DC contact pads on the upper surface of the RF component;
a first plurality of electrical connectors bridging the lower cavity, each one of the first plurality of electrical connectors having one end connected to a corresponding one of the RF contact pads on the upper surface of the RF component and another end of such one of plurality of conductors connected to a corresponding one of the plurality of RF contact pads on the upper surface of the circuit board;
a second plurality of electrical connector bridging the lower cavity, each one of the second plurality electrical connectors having one end connected to a corresponding one of the DC contact pads on the upper surface of the RF component and another end of such one of the second plurality of electrical connectors connected to a corresponding one of the DC contact pads on the upper surface of the circuit board;
a dielectric board having an electrical conductor on an upper surface and a bottom surface disposed on the upper surface of the circuit board, the dielectric board having an upper cavity in registration with the lower cavity, the upper cavity being wider than the lower cavity, the upper cavity exposing: the RF contact of the RF component; the DC contact pad of the RF component; the RF contact pad on the upper surface of the circuit board; the DC component on the upper surface of the circuit board; the first electrical connector; and the second electrical connector;
a plug member, disposed in the upper cavity, comprising: a dielectric support; and, a plurality of electrical conductors having a first portion disposed on a top surface of the dielectric support each one being connected to the electrical conductor on the upper surface of the dielectric board and a second portion disposed on a bottom surface of the dielectric support, the second portion of each one of the electrical conductors being disposed on, and electrically connected to, a corresponding one of the plurality of DC contact pads on the upper surface of the circuit board.