# US 10,321,553 B2 · Shield to improve electromagnetic interference (EMI) suppression capability

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- Number: US 10,321,553 B2
- Document ID: US10321553B2
- Status: Granted
- Kind: B2
- Application number: 14/451,360
- Filed: 2014-08-04
- Published: 2016-02-04
- Granted: 2019-06-11
- Earliest claimed: 2014-08-04
- Assignees: Cisco Technology, Inc.
- Applicants: Cisco Technology, Inc.
- Inventors: Hailong Zhang; Xiaoxia Zhou; Jinghan Yu; Philippe Sochoux; Xiao Li; Alpesh Bhobe
- Web page: https://patentgrep.com/patent/US10321553B2

## CPC

- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/02: Details
- H05K 1/023: {using auxiliary mounted passive components or auxiliary substances (printed passive components H05K1/16)}
- H05K 9/0031: {combining different shielding materials}
- H05K 9/0088: {comprising a plurality of shielding layers; combining different shielding material structure}
- H01R 43/00: Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28)
- H05K 1/0215: {Grounding of printed circuits by connection to external grounding means}
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/083: Magnetic materials
- H05K 2201/10409: Screws
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.

## Claims

### Claim 1

An electromagnetic interference (EMI) suppression apparatus comprising:
a heat sink;
an electrical component coupled to a first section of a bottom face of the heat sink;
EMI absorbing material surrounding the electrical component, and directly affixed to a second section of the bottom face of the heat sink, wherein the second section of the bottom face of the heat sink and the first section of the bottom face of the heat sink are different sections of the bottom face of the heat sink; and
electrically conductive material in contact with at least one side of the EMI absorbing material, the at least one side of the EMI absorbing material extending between the electrically conductive material and the electrical component,
wherein,
the EMI absorbing material includes a plurality of separate sections forming a rectangular shape that surrounds the electrical component, and an absorber corner tab disposed between each section of the plurality of separate sections to enclose the electrical component, and
the absorber corner tab including a fastener to secure the electrical component to the heat sink.

### Claim 2 (depends on 1)

The apparatus of claim 1, the electrically conductive material comprising at least one of a top section or one or more side sections, wherein the EMI absorbing material is at least partially covered by at least one of the top section or the one or more side sections of the electrically conductive material.

### Claim 3 (depends on 2)

The apparatus of claim 2, wherein the electrical component is an application specific integrated circuit (ASIC).

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein at least a portion of the conductive material comprises iron-loaded magnetic material.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein at least a portion of the EMI absorbing material comprises Q-ZORB material.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein at least a portion of the EMI absorbing material is elastic.

### Claim 7

A semiconductor device comprising:
a heat sink;
a printed circuit board having, an electrical component directly coupled to a first section of a bottom face of the heat sink; and
an electromagnetic interference (EMI) suppression shield in contact with at least one of the printed circuit board or a second section of the bottom face of the heat sink,
wherein,
the second section of the bottom face of the heat sink and the first section of the bottom face of the heat sink are different sections of the bottom face of the heat sink,
the shield includes electrically conductive material, and EMI absorbing material covered on at least one side by at least a portion of the electrically conductive material, the EMI absorbing material extending between the portion of the electrically conductive material and the electrical component,
the EMI absorbing material includes a plurality of separate sections forming a rectangular shape that surrounds the electrical component, and an absorber corner tab disposed between each section of the plurality of separate sections to enclose the electrical component, and
the absorber corner tab including a fastener to secure the electrical component to the heat sink.

### Claim 8 (depends on 7)

The semiconductor device of claim 7,
wherein,
the electrically conductive material includes at least one of a top section or one or more side sections, and
the EMI absorbing material is at least partially covered by at least one of the top section and the one or more side sections of the electrically conductive material.

### Claim 9 (depends on 7)

The semiconductor device of claim 7, wherein the conductive material comprises iron-loaded magnetic material.

### Claim 10 (depends on 7)

The semiconductor device of claim 7, wherein at least a portion of the EMI absorbing material comprises Q-ZORB material.

### Claim 11 (depends on 7)

The semiconductor device of claim 7, wherein the EMI absorbing material is elastic.

### Claim 12

An electromagnetic interference (EMI) suppressant shield comprising:
a layer of EMI absorbing material disposed between a printed circuit board and a second section of a bottom face of a heat sink;
an electrical component of the printed circuit board coupled to a first section of the bottom face of the heat sink, the first section of the bottom face of the heat sink and the second section of the bottom face of the heat sink are different sections of the bottom face of the heat sink; and
conductive material disposed along at least a portion of the layer of EMI absorbing material, and extending between the printed circuit board and the heat sink,
wherein
the layer of EMI absorbing material includes a plurality of separate sections forming a rectangular shape that surrounds the electrical component, and an absorber corner tab disposed between each section of the plurality of separate sections to enclose the electrical component, and
the absorber corner tab including a fastener to secure the printed circuit board to the heat sink.

### Claim 13 (depends on 12)

The EMI suppressant shield of claim 12, wherein the conductive material is disposed along a plurality of sides defining an outer periphery of the layer of EMI absorbing material.

### Claim 14 (depends on 12)

The EMI suppressant shield of claim 12, wherein the conductive material is formed between the second section of the bottom face of the heat sink and the layer of EMI absorbing material, and the layer of EMI absorbing material and the printed circuit board.

### Claim 15 (depends on 12)

The EMI suppressant shield of claim 12, wherein absorber corner tab comprises the conductive material at least partially wrapped around the EMI absorbing material.

### Claim 16 (depends on 12)

The EMI suppressant shield of claim 12, wherein at least a portion of the layer of EMI absorbing material comprises Q-ZORB material.

### Claim 17 (depends on 12)

The EMI suppressant shield of claim 12, wherein at least a portion of the layer of EMI absorbing material is elastic.

### Claim 18 (depends on 12)

The EMI suppressant shield of claim 12,
wherein,
the conductive material includes a top section and one or more side sections; and
the layer of EMI absorbing material is at least partially covered by at least one of the top section or the one or more side sections of the conductive material.

### Claim 19 (depends on 7)

The semiconductor device of claim 7,
wherein,
the electromagnetic interference (EMI) suppression shield is in contact with the printed circuit board and the second section of the bottom face of the heat sink.