# US 10,321,237 B2 · Multi-layer voice coil plate and flat type speaker comprising the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,321,237 B2 - Document ID: US10321237B2 - Status: Granted - Kind: B2 - Application number: 15/569,385 - Filed: 2016-04-28 - Published: 2018-10-11 - Granted: 2019-06-11 - Earliest claimed: 2015-04-28 - Assignees: Icubes Co., Ltd - Applicants: Icubes Co., Ltd - Inventors: Dong Hoon Min; Joo Bae Kim; Soon Kwan Kwon - Web page: https://patentgrep.com/patent/US10321237B2 ## CPC - H04R 9/06: Loudspeakers - H04R 7/04: Plane diaphragms - H04R 7/18: at the periphery - H04R 9/025: {Magnetic circuit} - H04R 9/04: Construction, mounting, or centering of coil - H04R 9/046: {Construction} - H04R 9/047: {in which the windings of the moving coil lay in the same plane} - H05K 1/16: incorporating printed electric components, e.g. printed resistors, capacitors or inductors - H05K 1/165: {incorporating printed inductors} - H05K 3/4614: {the electrical connections between the circuit boards being made during lamination} - H04R 2209/041: Voice coil arrangements comprising more than one voice coil unit on the same bobbin - H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers} - H05K 2201/10083: Electromechanical or electro-acoustic component, e.g. microphone - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A multilayer voice coil plate and a flat speaker including the same are capable of significantly reducing difficulties in designing and manufacturing a multilayer voice coil pattern. The multilayer voice coil plate may include: a first-type voice coil pattern layer formed in the shape of a track and connected from a first outer via hole outside the track to an inner via hole disposed in the track; and a second-type voice coil pattern layer formed in the shape of a track and connected from a second outer via hole outside the track to an inner via hole disposed in the track. The plurality of first-type voice coil pattern layers and the plurality of second-type voice coil pattern layers may be stacked so as to be insulated from each other, and the first outer via holes, the second outer via holes and the inner via holes may be electrically connected through interlayer conductors, respectively. ## Claims ### Claim 1 A multilayer voice coil plate comprising: a plurality of first-type voice coil pattern layers, each of the first-type voice coil pattern layer formed in the shape of a track and connected from a first outer via hole outside the track to an inner via hole disposed in the track; and a plurality of second-type voice coil pattern layers, each of the second-type voice coil pattern layer formed in the shape of a track and connected from a second outer via hole outside the track to an inner via hole disposed in the track, wherein the plurality of first-type voice coil pattern layers and the plurality of second-type voice coil pattern layers are stacked so as to be insulated from each other, and the first outer via holes, the second outer via holes and the inner via holes in the plurality of voice coil pattern layers are electrically connected through interlayer conductors, respectively, wherein the inner via holes of the plurality of first-type voice coil pattern layers and the inner via holes of the plurality of second-type voice coil pattern layers are vertically aligned at the same position so that the inner via holes of the plurality of first-type voice coil pattern layers and the inner via holes of the plurality of second-type voice coil pattern layers are electrically connected to each other through one interlayer conductor of the interlayer conductors. ### Claim 2 (depends on 1) The multilayer voice coil plate of claim 1, wherein the plurality of first-type voice coil pattern layers are connected in parallel to each other between the first outer via hole and the inner via hole, the plurality of second-type voice coil pattern layers are connected in parallel to each other between the inner via hole and the second outer via hole, and the plurality of first-type voice coil pattern layers and the plurality of second-type voice coil pattern layers are connected in series to each other through the inner via hole set to a contact therebetween. ### Claim 3 A multilayer voice coil plate comprising: a pair of base substrates facing each other; inner voice coil pattern layers formed on both surfaces of each of the pair of base substrates, respectively; insulating films covering the respective surfaces of the inner voice coil pattern layers on both surfaces of each of the pair of base substrates; and an outer voice coil pattern layer formed on each of the insulating films of outer surfaces of the pair of base substrates, with an adhesive layer interposed therebetween, wherein two insulating films on inner surfaces of the pair of base substrates, facing each other, are bonded to each other with an adhesive layer. ### Claim 4 (depends on 3) The multilayer voice coil plate of claim 3, wherein each of the plurality of voice coil pattern layers including the inner voice coil pattern layers and the outer voice coil pattern layers is a first-type or second-type voice coil pattern layer, the first-type voice coil pattern layer is formed in the shape of a track and connected from a first outer via hole outside the track to an inner via hole in the track, the second-type voice coil pattern layer is formed in the shape of a track and connected from a second outer via hole outside the track to the inner via hole in the track, and the first outer via holes, the second outer via holes and the inner via holes in the plurality of voice coil pattern layers are electrically connected through interlayer conductors, respectively. ### Claim 5 (depends on 4) The multilayer voice coil plate of claim 4, wherein the plurality of voice coil pattern layers comprise the plurality of first-type voice coil pattern layers and the plurality of second-type voice coil pattern layers. ### Claim 6 (depends on 4) The multilayer voice coil plate of claim 4, wherein the plurality of first-type voice coil pattern layers are connected in parallel to each other between the first outer via hole and the inner via hole, the plurality of second-type voice coil pattern layers are connected in parallel to each other between the inner via hole and the second outer via hole, and the plurality of first-type voice coil pattern layers and the plurality of second-type voice coil pattern layers are connected in series to each other through the inner via hole set to a contact therebetween. ### Claim 7 (depends on 4) The multilayer voice coil plate of claim 4, wherein the first-type voice coil pattern layer and the second-type voice coil pattern layer are stacked in such a manner that the inner via holes thereof are vertically aligned at the same position. ### Claim 8 A flat speaker comprising: a multilayer voice coil plate; a vibration plate vertically coupled to an upper edge of the multilayer voice coil plate, and configured to vibrate in a direction parallel to the multilayer voice coil plate; a first input terminal installed adjacent to a first end of the multilayer voice coil plate; and a second input terminal installed adjacent to a second end of the multilayer voice coil plate, wherein the multilayer voice coil plate comprises: a plurality of first-type voice coil pattern layers, each of the first-type voice coil pattern layer formed in the shape of a track and connected from a first outer via hole outside the track to an inner via hole disposed in the track; and a plurality of first-type voice coil pattern layers, each of the second-type voice coil pattern layer formed in the shape of a track and connected from a second outer via hole outside the track to an inner via hole disposed in the track, wherein the plurality of first-type voice coil pattern layers and the plurality of second-type voice coil pattern layers are stacked so as to be insulated from each other, and the first outer via holes and the second outer via holes are electrically connected through interlayer conductors, respectively, wherein the inner via holes of the plurality of first-type voice coil pattern layers and the inner via holes of the plurality of second-type voice coil pattern layers are vertically aligned at the same position so that the inner via holes of the plurality of first-type voice coil pattern layers and the inner via holes of the plurality of second-type voice coil pattern layers are electrically connected to each other through one interlayer conductor of the interlayer conductors. ### Claim 9 (depends on 8) The flat speaker of claim 8, wherein the plurality of first-type voice coil pattern layers are connected in parallel to each other between the first outer via hole and the inner via hole, the plurality of second-type voice coil pattern layers are connected in parallel to each other between the inner via hole and the second outer via hole, and the plurality of first-type voice coil pattern layers and the plurality of second-type voice coil pattern layers are connected in series to each other through the inner via hole set to a contact therebetween. ### Claim 10 A flat speaker comprising: a multilayer voice coil plate; a vibration plate vertically coupled to an upper edge of the multilayer voice coil plate, and configured to vibrate in a direction parallel to the multilayer voice coil plate; a first input terminal installed adjacent to a first end of the multilayer voice coil plate; and a second input terminal installed adjacent to a second end of the multilayer voice coil plate, wherein the multilayer voice coil plate comprises: a pair of base substrates facing each other; inner voice coil pattern layers formed on both surfaces of each of the pair of base substrates, respectively; insulating films covering the respective surfaces of the inner voice coil pattern layers on both surfaces of each of the pair of base substrates; and an outer voice coil pattern layer formed on the insulating film of each of outer surfaces of the pair of base substrates, with an adhesive layer interposed therebetween, wherein two insulating films of inner surfaces of the pair of base substrates, facing each other, are bonded to each other with an adhesive layer. ### Claim 11 (depends on 10) The flat speaker of claim 10, wherein each of the plurality of voice coil pattern layers including the inner voice coil pattern layers and the outer voice coil pattern layers is a first-type or second-type voice coil pattern layer, the first-type voice coil pattern layer is formed in the shape of a track and connected from a first outer via hole outside the track to an inner via hole in the track, the second-type voice coil pattern layer is formed in the shape of a track and connected from a second outer via hole outside the track to the inner via hole in the track, and the first outer via holes, the second outer via holes and the inner via holes in the plurality of voice coil pattern layers are electrically connected through interlayer conductors, respectively. ### Claim 12 (depends on 1) The multilayer voice coil plate of claim 1, wherein: each of the first-type and second-type voice coil pattern layers comprises one or more insulating layers, and the multilayer voice coil plate further comprises adhesive layers disposed between the insulating layers of the first-type and second-type voice coil pattern layers. ### Claim 13 (depends on 8) The flat speaker of claim 8, wherein: each of the first-type and second-type voice coil pattern layers comprises an insulating layer, and the multilayer voice coil plate further comprises adhesive layers disposed between the insulating layers of the first-type and second-type voice coil pattern layers.