# US 10,320,362 B2 · Elastic wave device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,320,362 B2 - Document ID: US10320362B2 - Status: Granted - Kind: B2 - Application number: 15/171,181 - Filed: 2016-06-02 - Published: 2016-09-22 - Granted: 2019-06-11 - Earliest claimed: 2013-12-27 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Taku Kikuchi; Shin Saijo; Hisashi Yamazaki; Masahiro Fukushima; Yuji Miwa - Web page: https://patentgrep.com/patent/US10320362B2 ## CPC - H03H 9/058: {for surface acoustic wave devices} - H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves - H03H 9/1071: {the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device} - H03H 9/14541: {Multilayer finger or busbar electrode} - H10N 30/875: {Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An elastic wave device includes a multilayer film provided on a support substrate and including a piezoelectric thin film and a layer other than the piezoelectric thin film, an interdigital transducer electrode provided on one surface of the piezoelectric thin film, and an external connection terminal electrically connected to the interdigital transducer electrode. In a plan view, the multilayer film is partially absent or omitted in a region outside a region where the interdigital transducer electrode is provided, and the elastic wave device further includes a first insulating layer provided on the support substrate in at least a portion of a region where the multilayer film is absent or omitted. ## Claims ### Claim 1 An elastic wave device comprising: a support substrate; a multilayer film provided on the support substrate and including a piezoelectric thin film; an interdigital transducer electrode provided on a surface of the piezoelectric thin film; an electrode pad electrically connected to the interdigital transducer electrode; and a first insulating layer provided on the support substrate in a region outside the multilayer film in a plan view in a direction of thickness of the support substrate, and located below the electrode pad. ### Claim 2 (depends on 1) The elastic wave device according to claim 1, wherein the first insulating layer is made of a resin. ### Claim 3 (depends on 1) The elastic wave device according to claim 1, wherein the support substrate is made of a conductor or a semiconductor, and the first insulating layer is located below an external connection terminal that is connected to the electrode pad. ### Claim 4 (depends on 3) The elastic wave device according to claim 3, wherein the first insulating layer is made of a resin. ### Claim 5 (depends on 1) The elastic wave device according to claim 1, further comprising: a wiring electrode connected to the interdigital transducer electrode; wherein the electrode pad is connected to the interdigital transducer electrode via the wiring electrode; and an external connection terminal is connected to the electrode pad. ### Claim 6 (depends on 1) The elastic wave device according to claim 1, wherein the first insulating layer includes an insulating layer extension portion extending from the region outside the multilayer film, to a region where the multilayer film is provided. ### Claim 7 (depends on 6) The elastic wave device according to claim 6, wherein the insulating layer extension portion covers a portion of the piezoelectric thin film. ### Claim 8 (depends on 5) The elastic wave device according to claim 5, wherein the wiring electrode extends from the upper surface of the multilayer film via a side surface of the multilayer film to the electrode pad. ### Claim 9 (depends on 8) The elastic wave device according to claim 8, wherein the side surface on which the wiring electrode of the multilayer film is provided is an inclined surface inclined from a direction perpendicular or substantially perpendicular to an upper surface of the support substrate, and the inclined surface is closer to the interdigital transducer electrode side as the inclined surface extends from below toward above. ### Claim 10 (depends on 9) The elastic wave device according to claim 9, wherein the inclined surface of the multilayer film includes a step. ### Claim 11 (depends on 9) The elastic wave device according to claim 9, wherein the first insulating layer covers at least a portion of the inclined surface. ### Claim 12 (depends on 1) The elastic wave device according to claim 1, wherein a plurality of interdigital transducer electrodes are provided as the interdigital transducer electrode provided on the surface of the piezoelectric thin film; and the elastic wave device further comprises a connection wire connecting the adjacent interdigital transducer electrodes to each other. ### Claim 13 (depends on 12) The elastic wave device according to claim 12, wherein portions of the layers of the multilayer film is provided between the connection wire and the support substrate. ### Claim 14 (depends on 13) The elastic wave device according to claim 13, wherein a second insulating layer is provided between the support substrate and the connection wire and is made of a same material as that of the first insulating layer. ### Claim 15 (depends on 1) The elastic wave device according to claim 1, wherein a third insulating layer is further provided between the multilayer film and the support substrate. ### Claim 16 (depends on 15) The elastic wave device according to claim 15, wherein the first insulating layer is provided on the third insulating layer and provided between a side surface of the multilayer film and the electrode pad. ### Claim 17 (depends on 1) The elastic wave device according to claim 1, wherein the first insulating layer extends from a height position located below the electrode pad via a side surface of the multilayer film to an upper surface of the multilayer film, and an outer surface of the first insulating layer on a side surface of the multilayer film is an inclined surface that is inclined from a direction perpendicular or substantially perpendicular to an upper surface of the support substrate and is closer to the interdigital transducer electrode side as the inclined surface extends from below toward above. ### Claim 18 (depends on 1) The elastic wave device according to claim 1, wherein the multilayer film includes, as other layers, a high-acoustic-velocity film through which a bulk wave propagates at an acoustic velocity higher than that of an elastic wave that propagates through the piezoelectric thin film, and a low-acoustic-velocity film on the high-acoustic-velocity film and through which a bulk wave propagates at an acoustic velocity lower than that of a bulk wave that propagates through the piezoelectric thin film; and the piezoelectric thin film is provided on the low-acoustic-velocity film. ### Claim 19 (depends on 1) The elastic wave device according to claim 1, further comprising a low-acoustic-velocity film provided on a lower surface of the piezoelectric thin film and through which a transversal wave propagates at a relatively low acoustic velocity; wherein the support substrate is a high-acoustic-velocity support substrate laminated on a lower surface of the low-acoustic-velocity film and through which a transversal wave propagates at a relatively high acoustic velocity compared to the relatively low acoustic velocity. ### Claim 20 (depends on 1) The elastic wave device according to claim 1, further comprising an external connection terminal connected to the electrode pad and including a metal bump. ### Claim 21 (depends on 1) The elastic wave device according to claim 1, further comprising: a frame-shaped support member surrounds a region where the interdigital transducer electrode is provided; and a lid member fixed on the support member so as to close an opening in the frame-shaped support member. ### Claim 22 (depends on 21) The elastic wave device according to claim 21, further comprising an external connection terminal connected to the electrode pad and including an under bump metal layer and a metal bump joined to the under bump metal layer. ### Claim 23 (depends on 1) The elastic wave device according to claim 1, further comprising: a wiring electrode connected to the interdigital transducer electrode and the electrode pad; and an external connection terminal electrically connected to the electrode pad and located above the electrode pad.