# US 10,320,355 B2 · Method of manufacturing elastic wave device

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- Number: US 10,320,355 B2
- Document ID: US10320355B2
- Status: Granted
- Kind: B2
- Application number: 14/705,029
- Filed: 2015-05-06
- Published: 2015-08-20
- Granted: 2019-06-11
- Earliest claimed: 2012-12-05
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Mitsuyoshi Hira; Seiji Kai
- Web page: https://patentgrep.com/patent/US10320355B2

## CPC

- H03H 3/02: for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence)
- H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves
- H03H 9/1092: {the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's}
- H10N 30/081: by coating or depositing using masks, e.g. lift-off
- H10N 30/088: by cutting or dicing
- H10N 30/87: Electrodes or interconnections, e.g. leads or terminals
- H03H 2003/0478: {in a process for mass production}
- H10N 30/02: Forming enclosures or casings
- Y10T 29/42: Piezoelectric device making
- Y10T 29/49005: Acoustic transducer
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.

## Claims

### Claim 1

A method for manufacturing an elastic wave device comprising:
a step of forming a plurality of functional element units and a connection line that electrically connects the plurality of functional element units on one principal surface of a motherboard having piezoelectricity;
a step of forming a support layer made of resin that encloses the functional element units on the one principal surface of the motherboard; and
a step of obtaining an elastic wave device having the functional element units by a step of dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line; wherein
the connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected;
the line main body and the connection unit are both formed in the step of forming the plurality of functional element units and the connection line;
the step of dividing the multilayer body includes a step of dicing the multilayer body along the dicing line such that electrical connection between the connection unit and the line main body is broken;
the connection unit is electrically connected to the line main body and the functional element units before the step of dicing the multilayer body; and
the method further including a step of forming a retaining member made of resin which straddles the line main body in a width direction of the line main body and is separate from the support layer on the motherboard prior to dividing the multilayer body.

### Claim 2 (depends on 1)

The method for manufacturing an elastic wave device according to claim 1, wherein the retaining member is formed to cover an end portion of the connection unit on a line main body side.

### Claim 3 (depends on 1)

The method for manufacturing an elastic wave device according to claim 1, wherein the retaining member is formed so that an area where the retaining member is not provided is larger than an area where the retaining member is provided in a region in which the dicing line is positioned.

### Claim 4 (depends on 1)

The method for manufacturing an elastic wave device according to claim 1, wherein the retaining member and the support layer are formed in a same step or a same technical process.

### Claim 5 (depends on 1)

The method for manufacturing an elastic wave device according to claim 1, wherein the elastic wave device is one of a surface acoustic wave device and a boundary wave device.

### Claim 6 (depends on 1)

The method for manufacturing an elastic wave device according to claim 1, wherein the plurality of functional element units are formed in a matrix configuration on the motherboard.

### Claim 7 (depends on 1)

The method for manufacturing an elastic wave device according to claim 1, wherein the retaining member includes an intersecting portion that is not connected to the support layer and intersects with the line main body.

### Claim 8 (depends on 7)

The method for manufacturing an elastic wave device according to claim 7, wherein only the intersecting portion of the retaining member is formed on the line main body and a portion of the retaining member other than the intersecting portion is not provided on the line main body.

### Claim 9 (depends on 1)

The method for manufacturing an elastic wave device according to claim 1, further comprising a step of providing a cover to be supported by the support layer and to cover the functional element units.

### Claim 10 (depends on 9)

The method for manufacturing an elastic wave device according to claim 9, further comprising the step of forming via holes in the cover and the support layer.

### Claim 11 (depends on 1)

The method for manufacturing an elastic wave device according to claim 1, wherein an area where the retaining member is not disposed is larger than an area where the retaining member is disposed on the dicing line.

### Claim 12 (depends on 1)

The method for manufacturing an elastic wave device according to claim 1, wherein the retaining member includes a plurality of intersecting portions not connected to the support layer and intersecting with the line main body, the plurality of intersecting portions being arranged at set intervals on a side of each region of the multilayer body.