# US 10,320,145 B2 · Solder sealing in high-power laser devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,320,145 B2 - Document ID: US10320145B2 - Status: Granted - Kind: B2 - Application number: 15/807,824 - Filed: 2017-11-09 - Published: 2018-03-08 - Granted: 2019-06-11 - Earliest claimed: 2015-01-27 - Assignees: Teradiode, Inc. - Applicants: Parviz Tayebati; Michael Deutsch - Inventors: Parviz Tayebati; Michael Deutsch - Web page: https://patentgrep.com/patent/US10320145B2 ## CPC - H01S 5/02355: Fixing laser chips on mounts - H01S 3/08009: {using a diffraction grating} - H01S 5/0216: {using an intermediate compound, e.g. a glue or solder} - H01S 5/0237: by soldering - H01S 5/142: {which comprises an additional resonator} - H01S 5/4012: {Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms} - H01S 5/4025: {Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence)} - H01S 5/4062: {with an external cavity or using internal filters, e.g. Talbot filters} - H01S 5/4087: {emitting more than one wavelength} - H01S 5/02423: {Liquid cooling, e.g. a liquid cools a mount of the laser} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers. ## Claims ### Claim 1 A method of sealing a laser apparatus, the method comprising: disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material; thereafter, depositing an electrically conductive sealing material over at least a portion of the thermal bonding layer and at least a portion of an external surface of the electrode mount, wherein the thermal bonding material and the sealing material comprise different materials; and disposing a beam emitter in direct mechanical contact with the thermal bonding layer, wherein at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer. ### Claim 2 (depends on 1) The method of claim 1, further comprising: covering a portion of the thermal bonding layer with a masking material before depositing the sealing material; and after depositing the sealing material, removing the masking material before disposing the beam emitter in direct contact with the thermal bonding layer. ### Claim 3 (depends on 1) The method of claim 1, wherein depositing the sealing material comprises at least one of electroplating or electroless deposition. ### Claim 4 (depends on 1) The method of claim 1, wherein the thermal bonding material comprises indium. ### Claim 5 (depends on 1) The method of claim 1, wherein the sealing material comprises at least one of copper, aluminum, nickel, or chromium. ### Claim 6 (depends on 1) The method of claim 1, further comprising disposing a second electrode mount over the beam emitter opposite the electrode mount. ### Claim 7 (depends on 6) The method of claim 6, further comprising: disposing a second thermal bonding layer between the second electrode mount and the beam emitter, the second thermal bonding layer comprising a second thermal bonding material; and positioning a second sealing material to prevent or retard movement of the second thermal bonding material out of the second thermal bonding layer. ### Claim 8 (depends on 1) The method of claim 1, wherein the beam emitter comprises a diode bar configured to emit a plurality of discrete beams. ### Claim 9 (depends on 1) The method of claim 1, wherein a melting point of the sealing material is higher than a melting point of the thermal bonding material. ### Claim 10 (depends on 1) The method of claim 1, wherein no portion of the sealing material is disposed between the thermal bonding layer and the electrode mount. ### Claim 11 (depends on 1) The method of claim 1, wherein a portion of the sealing material is in direct contact with an external surface of the beam emitter. ### Claim 12 (depends on 1) The method of claim 1, wherein a portion of the sealing material is disposed on a portion of the external surface of the electrode mount that does not face toward the beam emitter. ### Claim 13 (depends on 1) The method of claim 1, wherein, after the beam emitter is disposed in direct contact with the thermal bonding layer, the thermal bonding layer is surrounded on all sides by the sealing material, the electrode mount, and the beam emitter. ### Claim 14 A method of sealing a laser apparatus, the method comprising: disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material; disposing a beam emitter in direct mechanical contact with the thermal bonding layer; and after the thermal bonding layer is disposed over the surface of the electrode mount, and after the beam emitter is disposed in direct contact with the thermal bonding layer, depositing an electrically conductive sealing material over at least a portion of the thermal bonding layer and at least a portion of an external surface of the electrode mount, wherein (i) the thermal bonding material and the sealing material comprise different materials, and (ii) at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer. ### Claim 15 (depends on 14) The method of claim 14, further comprising: covering a portion of the beam emitter with a masking material before depositing the sealing material; and removing the masking material after depositing the sealing material. ### Claim 16 (depends on 14) The method of claim 14, wherein depositing the sealing material comprises at least one of electroplating or electroless deposition. ### Claim 17 (depends on 14) The method of claim 14, wherein the thermal bonding material comprises indium. ### Claim 18 (depends on 14) The method of claim 14, wherein the sealing material comprises at least one of copper, aluminum, nickel, or chromium. ### Claim 19 (depends on 14) The method of claim 14, further comprising disposing a second electrode mount over the beam emitter opposite the electrode mount. ### Claim 20 (depends on 19) The method of claim 19, further comprising: disposing a second thermal bonding layer between the second electrode mount and the beam emitter, the second thermal bonding layer comprising a second thermal bonding material; and positioning a second sealing material to prevent or retard movement of the second thermal bonding material out of the second thermal bonding layer. ### Claim 21 (depends on 14) The method of claim 14, wherein the beam emitter comprises a diode bar configured to emit a plurality of discrete beams. ### Claim 22 (depends on 14) The method of claim 14, wherein a melting point of the sealing material is higher than a melting point of the thermal bonding material. ### Claim 23 (depends on 14) The method of claim 14, wherein no portion of the sealing material is disposed between the thermal bonding layer and the electrode mount. ### Claim 24 (depends on 14) The method of claim 14, wherein a portion of the sealing material is in direct contact with an external surface of the beam emitter. ### Claim 25 (depends on 14) The method of claim 14, wherein a portion of the sealing material is disposed on a portion of the external surface of the electrode mount that does not face toward the beam emitter. ### Claim 26 (depends on 14) The method of claim 14, wherein, after the sealing material is deposited over the at least a portion of the thermal bonding layer and the at least a portion of the external surface of the electrode mount, the thermal bonding layer is surrounded on all sides by the sealing material, the electrode mount, and the beam emitter. ### Claim 27 A method of sealing a laser apparatus, the method comprising: disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material; thereafter, depositing an electrically conductive sealing material over an entirety of the thermal bonding layer and at least a portion of an external surface of the electrode mount; removing a portion of the sealing material to reveal an exposed portion of the thermal bonding layer; and disposing a beam emitter in direct contact with the exposed portion of the thermal bonding layer, wherein at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer. ### Claim 28 A method of sealing a laser apparatus, the method comprising: disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material; disposing a beam emitter in direct contact with the thermal bonding layer; after the thermal bonding layer is disposed over the surface of the electrode mount, and after the beam emitter is disposed in direct contact with the thermal bonding layer, depositing an electrically conductive sealing material over at least a portion of the thermal bonding layer and at least a portion of an external surface of the electrode mount; depositing the sealing material over at least a portion of the beam emitter; and removing at least a portion of the sealing material to reveal a portion of the beam emitter, wherein at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer.