# US 10,320,106 B2 · Electrical component socket > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,320,106 B2 - Document ID: US10320106B2 - Status: Granted - Kind: B2 - Application number: 15/771,217 - Filed: 2016-10-24 - Published: 2018-11-08 - Granted: 2019-06-11 - Earliest claimed: 2015-10-27 - Assignees: Enplas Corporation - Applicants: Enplas Corporation - Inventors: Yuki Ueyama - Web page: https://patentgrep.com/patent/US10320106B2 ## CPC - H01R 13/04: Pins or blades for co-operation with sockets - G01R 1/0466: {concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding} - G01R 31/26: Testing of individual semiconductor devices (testing of photovoltaic devices H02S50/10; testing or measuring during manufacture or treatment {H10P74/00}) - H01R 12/70: Coupling devices - H01R 13/24: resilient; resiliently-mounted - H01R 33/76: Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket - G01R 31/2863: {Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04)} - H01R 12/7076: {for connection between PCB and component, e.g. display} - H01R 12/714: {with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit} - H01R 13/2435: {with opposite contact points, e.g. C beam} - H01R 13/2471: {pin shaped} - H01R 2201/20: for testing or measuring purposes - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract For an electrical component socket including a socket base having a frame shape to which a contact module is to be inserted and attached from below, an embodiment has an objective to allow contact pins to be in contact with a circuit board with stability. The electrical component socket is configured such that the upper-side plate is caused to ascend to an uppermost position by elastic force of urging means in a state where the contact module is not attached to the socket base. In a state where the contact module is attached to the socket base and disposed on the circuit board, the upper-side plate moves down toward a lower-side plate side against elastic force of the contact pins to be positioned at a predetermined base position, so that lower-side contact portions of the contact pins are brought into contact with the circuit board at a predetermined contact pressure. ## Claims ### Claim 1 An electrical component socket comprising: a contact module that includes a module body in which contact pins are arranged to elastically expand and contract freely in a vertical direction, the contact module being configured to receive an electrical component; and a socket base that has a frame shape and is configured to be disposed on a circuit board with the contact module attached to the socket base, the electrical component socket causing the electrical component and the circuit board to be electrically connected to each other by upper-side contact portions and lower-side contact portions of the contact pins being in contact with the electrical component and the circuit board, respectively, wherein the module body includes a lower-side plate, and an upper-side plate disposed to move upward and downward freely relative to the lower-side plate, the socket base includes a height-fixing portion that is configured to regulate a position of the upper-side plate, in a first state where the contact module is not attached to the socket base, the upper-side plate is caused to ascend to an uppermost position by an urging force, in a second state where the contact module is attached to the socket base and disposed on the circuit board, the contact module is sandwiched in the vertical direction by the height-fixing portion of the socket base and the circuit board, and the upper-side plate moves down toward the lower-side plate side against the urging force to be positioned at a predetermined base position, so that the lower-side contact portions of the contact pins are brought into contact with the circuit board at a predetermined contact pressure, and the height-fixing portion regulates the position of the upper-side plate in the second state by a predetermined height amount lower than the position of the upper-side plate in the first state. ### Claim 2 (depends on 1) The electrical component socket according to claim 1, wherein in the first state where the contact module is not attached to the socket base, a height of the contact module is set to be greater than a base height of a time when the upper-side plate is positioned at the base position. ### Claim 3 (depends on 1) The electrical component socket according to claim 1, wherein the predetermined height amount is determined so as to include a difference amount which is a difference between a height of the contact module and a designed height value of the contact module. ### Claim 4 (depends on 1) The electrical component socket according to claim 1, wherein the contact pins urge the upper-side plate upward, and thereby operate to provide the urging force. ### Claim 5 (depends on 4) The electrical component socket according to claim 4, wherein in the first state where the contact module is not attached to the socket base, a height of the contact module is set to be greater than a base height of a time when the upper-side plate is positioned at the base position. ### Claim 6 An electrical component socket comprising: a contact module that includes a module body in which contact pins are arranged to elastically expand and contract freely in a vertical direction, the contact module being configured to receive an electrical component; and a socket base that has a frame shape and is configured to be disposed on a circuit board with the contact module attached to the socket base, the electrical component socket causing the electrical component and the circuit board to be electrically connected to each other by upper-side contact portions and lower-side contact portions of the contact pins being in contact with the electrical component and the circuit board, respectively, wherein the module body includes a lower-side plate, and an upper-side plate disposed to move upward and downward freely relative to the lower-side plate, the socket base includes a height-fixing portion that is configured to regulate a position of the upper-side plate, in a first state where the contact module is not attached to the socket base, the upper-side plate is caused to ascend to an uppermost position by an urging force, in a second state where the contact module is attached to the socket base and disposed on the circuit board, the contact module is sandwiched in the vertical direction by the height-fixing portion of the socket base and the circuit board, and the upper-side plate moves down toward the lower-side plate side against the urging force to be positioned at a predetermined base position, so that the lower-side contact portions of the contact pins are brought into contact with the circuit board at a predetermined contact pressure, and the upper-side plate moves down toward the lower-side plate side lower in the second state than in the first state. ### Claim 7 (depends on 6) The electrical component socket according to claim 6, wherein in the first state where the contact module is not attached to the socket base, a height of the contact module is set to be greater than a base height of a time when the upper-side plate is positioned at the base position. ### Claim 8 (depends on 6) The electrical component socket according to claim 6, wherein the contact pins urge the upper-side plate upward, and thereby operate to provide the urging force. ### Claim 9 (depends on 8) The electrical component socket according to claim 8, wherein in the first state where the contact module is not attached to the socket base, a height of the contact module is set to be greater than a base height of a time when the upper-side plate is positioned at the base position.