# US 10,320,071 B2 · Methods for selectively shielding radio frequency modules > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,320,071 B2 - Document ID: US10320071B2 - Status: Granted - Kind: B2 - Application number: 15/490,349 - Filed: 2017-04-18 - Published: 2017-10-19 - Granted: 2019-06-11 - Earliest claimed: 2016-04-19 - Assignees: Skyworks Solutions, Inc. - Applicants: Skyworks Solutions, Inc. - Inventors: Hoang Mong Nguyen; Anthony James LoBianco; Gregory Edward Babcock; Darren Roger Frenette; George Khoury - Web page: https://patentgrep.com/patent/US10320071B2 ## CPC - H01Q 1/526: {Electromagnetic shields} - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/2291: {used in Bluetooth® or Wi-Fi® devices of Wireless Local Area Networks [WLAN] (H01Q1/241 takes precedence; WLAN in general H04W)} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 9/42: with folded element, the folded parts being spaced apart a small fraction of the operating wavelength - H10P 14/412: {Deposition of metallic or metal-silicide materials} - H10P 14/418: {the conductive layers comprising transition metals} - H10P 14/44: Physical vapour deposition [PVD] - H10P 34/42: with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 76/00: Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/50: Bond wires - H10W 44/206: {Wires} - H10W 44/226: {for HF amplifiers} - H10W 44/234: {Arrangements for impedance matching} - H10W 44/248: {for antennas} - H10W 74/10: characterised by their shape or disposition - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer. ## Claims ### Claim 1 A method of selectively shielding a radio frequency module, the method comprising: providing a radio frequency module including a radio frequency component, an antenna, and wire bonds disposed between the radio frequency component and the antenna; masking a first portion of the radio frequency module over the antenna with a masking material such that a second portion of the radio frequency module over the radio frequency component is not covered by the masking material; and after said masking, forming a shielding layer over the radio frequency module such that (i) the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer and (ii) the shielding layer is in contact with the wire bonds to provide shielding between the radio frequency component and the antenna. ### Claim 2 (depends on 1) The method of claim 1 wherein said forming includes removing the masking material over the antenna. ### Claim 3 (depends on 1) The method of claim 1 wherein said masking includes masking the radio frequency module with the masking material and laser cutting a selected area of the masking material. ### Claim 4 (depends on 1) The method of claim 1 wherein said forming includes sputtering a conductive material and the shielding layer includes the conductive material. ### Claim 5 (depends on 4) The method of claim 4 wherein the conductive material includes copper. ### Claim 6 (depends on 4) The method of claim 4 further comprising forming a protective layer over the shielding layer such that the shielding layer is disposed between the protective layer and the radio frequency component. ### Claim 7 (depends on 6) The method of claim 6 wherein the protective layer includes titanium. ### Claim 8 (depends on 1) The method of claim 1 further comprising singulating the radio frequency module prior to said forming. ### Claim 9 (depends on 1) The method of claim 1 further comprising singulating the radio frequency module after said forming. ### Claim 10 (depends on 1) The method of claim 1 wherein the radio frequency module includes a package substrate on which the radio frequency component and the antenna are disposed, and the shielding layer is formed substantially parallel to the package substrate. ### Claim 11 A method of selectively shielding a radio frequency module, the method comprising: providing a radio frequency module including a radio frequency component and an antenna; masking a portion of the radio frequency module over the antenna with a masking material over a molding material such that an other portion of the radio frequency module over the radio frequency component is not covered by the masking material; forming a conductive layer over the portion of the radio frequency module and the other portion of the radio frequency module; and removing the masking material such that a shielding layer is over the radio frequency component and the antenna is unshielded by the shielding layer, the shielding layer including conductive material of the conductive layer. ### Claim 12 (depends on 11) The method of claim 11 wherein said masking includes laser cutting a selected area of the masking material. ### Claim 13 (depends on 11) The method of claim 11 wherein the shielding layer is in contact with wire bonds disposed between the radio frequency component and the antenna after said removing. ### Claim 14 (depends on 11) The method of claim 11 wherein the molding material has substantially the same thickness over the antenna as over the radio frequency component after said removing. ### Claim 15 (depends on 11) The method of claim 11 wherein the masking material includes tape. ### Claim 16 (depends on 1) The method of claim 1 wherein the providing includes providing the radio frequency module with additional wire bonds disposed along an edge of the radio frequency module. ### Claim 17 (depends on 11) The method of claim 11 wherein said providing includes providing the radio frequency module with wire bonds disposed along an edge of the radio frequency module. ### Claim 18 (depends on 11) The method of claim 11 wherein the shielding layer is in contact with wire bonds disposed between the radio frequency component and the antenna after said removing. ### Claim 19 (depends on 11) The method of claim 11 further comprising singulating the radio frequency module prior to said forming. ### Claim 20 (depends on 11) The method of claim 11 further comprising singulating the radio frequency module after said forming. ### Claim 21 (depends on 11) The method of claim 11 further comprising forming a protective layer over the shielding layer such that the shielding layer is disposed between the protective layer and the radio frequency component. ### Claim 22 (depends on 21) The method of claim 21 wherein the protective layer includes titanium.