# US 10,320,048 B2 · Circuit board and communication device with side coupler > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,320,048 B2 - Document ID: US10320048B2 - Status: Granted - Kind: B2 - Application number: 15/978,574 - Filed: 2018-05-14 - Published: 2019-02-21 - Granted: 2019-06-11 - Earliest claimed: 2017-08-17 - Assignees: Microelectronics Technology Inc. - Applicants: Microelectronics Technology, Inc. - Inventors: Ping-Chin Tseng - Web page: https://patentgrep.com/patent/US10320048B2 ## CPC - H01P 5/184: {the guides being strip lines or microstrips} - H01P 3/081: {Microstriplines} - H01P 5/107: Hollow-waveguide/strip-line transitions - H01P 5/187: {Broadside coupled lines} - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 1/181: associated with surface mounted components - H05K 5/0047: {having a two-part housing enclosing a PCB} - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K 2201/10151: Sensor - H05K 2201/10522: Adjacent components - H05K 2201/2018: Presence of a frame in a printed circuit or printed circuit assembly - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A communication device includes a circuit board having an upper surface and a lower surface, an upper housing disposed on the upper surface, and a lower housing disposed on the lower surface. The circuit board includes a top metal frame disposed on the upper surface, wherein the top metal frame defines a top cavity; a bottom metal frame disposed on the bottom surface, wherein the bottom metal frame defines a bottom cavity corresponding to the top cavity; a microstrip line disposed on the upper surface and extending into the top cavity; and a side coupler disposed on the lower surface and extending into the bottom cavity. The upper housing includes a depression corresponding to the top cavity, and the lower housing includes an aperture corresponding to the bottom cavity. ## Claims ### Claim 1 A circuit board, comprising: a substrate having an upper surface and a lower surface; a top metal frame disposed on the upper surface, wherein the top metal frame defines a top cavity; a bottom metal frame disposed on the bottom surface, wherein the bottom metal frame defines a bottom cavity corresponding to the top cavity; a microstrip line disposed on the upper surface and extending into the top cavity; and a side coupler disposed on the lower surface and extending into the bottom cavity. ### Claim 2 (depends on 1) The circuit board of claim 1, wherein the side coupler comprises a linear conductor having a first end extending into the bottom cavity and a second end connected to a through conductor, and the through conductor penetrates the substrate. ### Claim 3 (depends on 2) The circuit board of claim 2, further comprising a power conversion circuit disposed on the upper surface and electrically connected to the through conductor of the side coupler. ### Claim 4 (depends on 1) The circuit board of claim 1, further comprising a plurality of conductors electrically connecting the top metal frame to the bottom metal frame. ### Claim 5 (depends on 1) The circuit board of claim 1, wherein the top metal frame comprises a top passage gap, and the microstrip line extends into the top cavity through the top passage gap. ### Claim 6 (depends on 1) The circuit board of claim 1, wherein the bottom metal frame comprises a bottom passage gap, and the side coupler extends into the top cavity through the bottom passage gap. ### Claim 7 (depends on 1) The circuit board of claim 1, wherein the bottom metal frame and the side coupler are disposed on the same plane. ### Claim 8 (depends on 1) The circuit board of claim 1, wherein the side coupler is electrically isolated from the bottom metal frame. ### Claim 9 A communication device, comprising: a circuit board, wherein the circuit board comprises a substrate having an upper surface and a lower surface; a top metal frame disposed on the upper surface, wherein the top metal frame defines a top cavity; a bottom metal frame disposed on the bottom surface, wherein the bottom metal frame defines a bottom cavity corresponding to the top cavity; a microstrip line disposed on the upper surface and extending into the top cavity; and a side coupler disposed on the lower surface and extending into the bottom cavity; an upper housing disposed on the upper surface, wherein the upper housing comprises a depression corresponding to the top cavity; and a lower housing disposed on the lower surface, wherein the lower housing comprises an aperture corresponding to the bottom cavity. ### Claim 10 (depends on 9) The communication device of claim 9, wherein the upper space has a height of one quarter of the operating wavelength of the communication device. ### Claim 11 (depends on 9) The communication device of claim 9, further comprising an amplifier disposed on the upper surface and electrically connected to the microstrip line. ### Claim 12 (depends on 9) The communication device of claim 9, wherein the side coupler comprises a linear conductor having a first end extending into the bottom cavity and a second end connected to a through conductor, and the through conductor penetrates the substrate. ### Claim 13 (depends on 12) The communication device of claim 12, further comprising a power conversion circuit disposed on the upper surface and electrically connected to the through conductor of the side coupler. ### Claim 14 (depends on 9) The communication device of claim 9, wherein the circuit board further comprises a plurality of conductors electrically connecting the top metal frame to the bottom metal frame. ### Claim 15 (depends on 9) The communication device of claim 9, wherein the top metal frame comprises a top passage gap, and the microstrip line extends into the top cavity through the top passage gap. ### Claim 16 (depends on 9) The communication device of claim 9, wherein the bottom metal frame comprises a bottom passage gap, and the side coupler extends into the top cavity through the bottom passage gap. ### Claim 17 (depends on 9) The communication device of claim 9, wherein the bottom metal frame and the side coupler are disposed on the same plane. ### Claim 18 (depends on 9) The communication device of claim 9, wherein the side coupler is electrically isolated from the bottom metal frame. ### Claim 19 (depends on 9) The communication device of claim 9, wherein the depression forms a reflection waveguide. ### Claim 20 (depends on 9) The communication device of claim 9, wherein the aperture forms an output waveguide.