# US 10,320,047 B2 · Waveguide assembly comprising a molded waveguide interface having a support block for a launch transducer that is coupled to a communication device through a flange attached to the interface > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,320,047 B2 - Document ID: US10320047B2 - Status: Granted - Kind: B2 - Application number: 15/850,525 - Filed: 2017-12-21 - Published: 2018-04-26 - Granted: 2019-06-11 - Earliest claimed: 2009-08-19 - Assignees: Vubiq Networks, Inc. - Applicants: Vubiq Networks, Inc. - Inventors: Michael Gregory Pettus - Web page: https://patentgrep.com/patent/US10320047B2 ## CPC - H01P 5/107: Hollow-waveguide/strip-line transitions - H01P 1/042: {Hollow waveguide joints} - H10W 72/07554: {changes in dispositions} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/547: {Dispositions of multiple bond wires} - H10W 72/932: {Plan-view shape, i.e. in top view} - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A waveguide interface comprising a support block configured to support a printed circuit board assembly. An interface is coupled to an end portion of the support block and extends from the support block. The interface includes a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide component. The support block and interface are molded as a monolithic device. A method of forming the waveguide interface, a waveguide assembly including the waveguide interface, and a method of making the waveguide assembly including the waveguide interface are also disclosed. ## Claims ### Claim 1 A waveguide interface comprising: a monolithic molded device comprising a support block configured to support a printed circuit board assembly and an interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide flange. ### Claim 2 (depends on 1) The waveguide interface of claim 1, wherein the support block and the interface are formed from a moldable metal alloy. ### Claim 3 (depends on 1) The waveguide interface of claim 1, wherein the support block and interface comprise a plurality of draft angles along one or more surfaces of the support block and the interface to allow for removal from a mold. ### Claim 4 A waveguide assembly comprising: a monolithic molded waveguide interface comprising a support block having a printed circuit board assembly affixed thereto and an interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly; a launch transducer comprising one or more transmission lines in a first portion of the launch transducer and at least one transducer element coupled to the one or more transmission lines in a second portion of the launch transducer, wherein the at least one transducer element is configured to propagate millimeter wave frequency signals; a communication device coupled to the printed circuit board assembly, wherein the launch transducer is positioned adjacent to and coupled to the communication device; and a waveguide flange coupled to the interface of the waveguide interface, the waveguide flange having a waveguide opening, wherein the interface has one or more holes positioned to receive attachment devices to secure the waveguide flange to the interface. ### Claim 5 (depends on 4) The waveguide assembly of claim 4, wherein the interface is positioned flush against the waveguide flange such that a narrow dimension of the slot within the interface is orthogonal to an H-field dimension of the waveguide flange. ### Claim 6 (depends on 4) The waveguide assembly of claim 4, wherein the first portion of the launch transducer is positioned within the slot within the interface such that the slot prevents energy from the transmission line from being emitted toward the printed circuit board or the waveguide opening and allows energy to pass from the at least one transducer element into the waveguide opening. ### Claim 7 (depends on 4) The waveguide assembly of claim 4, wherein the communication device is configured to transmit and receive millimeter wave signals. ### Claim 8 (depends on 4) The waveguide assembly of claim 4, wherein the launch transducer further comprises a low-loss dielectric material with deposited metallization. ### Claim 9 (depends on 4) The waveguide assembly of claim 4, wherein the second portion of the launch transducer is positioned within the waveguide opening. ### Claim 10 (depends on 4) The waveguide assembly of claim 4, wherein the launch transducer is positioned near a top surface of the support block midway between opposing edges of the top surface of the support block. ### Claim 11 (depends on 4) The waveguide assembly of claim 4, wherein the communication device is positioned within a recess in the printed circuit board such that the first portion of the launch transducer is at a predetermined height within the slot within the interface. ### Claim 12 (depends on 4) The waveguide assembly of claim 4, wherein the launch transducer is positioned to provide maximum energy propagation along a central axis of the waveguide interface. ### Claim 13 (depends on 4) The waveguide assembly of claim 4, wherein the launch transducer has an operating frequency range between 57 GHz to 66 GHz. ### Claim 14 (depends on 4) The waveguide assembly of claim 4, wherein the slot within the interface comprises sidewalls having a draft angle of about two degrees, wherein the draft angle impacts transmission of millimeter waveguide energy into the waveguide opening by less than one percent.