# US 10,319,896 B2 · Shielded interconnects

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- Number: US 10,319,896 B2
- Document ID: US10319896B2
- Status: Granted
- Kind: B2
- Application number: 15/637,682
- Filed: 2017-06-29
- Published: 2019-01-03
- Granted: 2019-06-11
- Earliest claimed: 2017-06-29
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Javier A. Falcon; Adel A. Elsherbini; Johanna M. Swan; Shawna M. Liff; Ye Seul Nam; James S. Clarke; Jeanette M. Roberts; Roman Caudillo
- Web page: https://patentgrep.com/patent/US10319896B2

## CPC

- H10N 60/815: {for Josephson-effect devices}
- G06N 10/40: Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
- H01P 3/081: {Microstriplines}
- H01P 11/003: {Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines}
- H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)}
- H05K 1/0221: {Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines}
- H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line}
- H05K 3/4682: {Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil}
- H05K 7/20372: {Cryogenic cooling; Nitrogen liquid cooling}
- H10N 60/0912: {of Josephson-effect devices}
- H10N 60/12: Josephson-effect devices
- H10N 60/805: {for Josephson-effect devices}
- H10N 69/00: Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/688: {Flexible insulating substrates}
- H10W 90/00: Package configurations
- H01P 3/06: Coaxial lines
- H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)}
- H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)}
- H05K 2201/037: Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
- H05K 2203/308: Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- G06N: COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Disclosed herein are shielded interconnects, as well as related methods, assemblies, and devices. In some embodiments, a shielded interconnect may be included in a quantum computing (QC) assembly. For example, a QC assembly may include a quantum processing die; a control die; and a flexible interconnect electrically coupling the quantum processing die and the control die, wherein the flexible interconnect includes a plurality of transmission lines and a shield structure to mitigate cross-talk between the transmission lines.

## Claims

### Claim 1

A quantum computing (QC) assembly, comprising:
a quantum processing die;
a control die; and
a flexible interconnect electrically coupling the quantum processing die and the control die,
wherein the flexible interconnect includes a plurality of transmission lines and a shield structure to mitigate cross-talk between the transmission lines, and the shield structure includes a plurality of air gaps.

### Claim 2 (depends on 1)

The QC assembly of claim 1, wherein the flexible interconnect includes a flexible portion having a first end and an opposing second end, a first rigid connection portion at the first end, and a second rigid connection portion at the second end.

### Claim 3 (depends on 2)

The QC assembly of claim 2, further comprising:
a circuit component;
wherein the quantum processing die and the first rigid connection portion are coupled to the circuit component, and the circuit component includes electrical pathways to electrically couple the quantum processing die and the first rigid connection portion.

### Claim 4 (depends on 1)

The QC assembly of claim 1, wherein the plurality of transmission lines have a longitudinal portion and at least one transverse portion.

### Claim 5 (depends on 4)

The QC assembly of claim 4, wherein a pitch of the plurality of transmission lines in the longitudinal portion is less than a pitch of the plurality of transmission lines in the transverse portion.

### Claim 6 (depends on 4)

The QC assembly of claim 4, wherein the shield structure includes a plurality of rectangular sleeves in the longitudinal portion, and a plurality of hexagonal sleeves in the transverse portion.

### Claim 7 (depends on 1)

The QC assembly of claim 1, wherein the shield structure includes a plurality of rectangular sleeves.

### Claim 8 (depends on 1)

The QC assembly of claim 1, wherein individual ones of the air gaps are fluidly coupled to one or more external openings in the flexible interconnect.

### Claim 9 (depends on 1)

The QC assembly of claim 1, wherein at least some of the air gaps are disposed around transmission lines.

### Claim 10 (depends on 1)

The QC assembly of claim 1, wherein at least some of the air gaps are disposed between portions of dielectric material that surround different transmission lines.

### Claim 11 (depends on 1)

The QC assembly of claim 1, wherein the control die includes a multiplexer or a filter.

### Claim 12 (depends on 1)

The QC assembly of claim 1, wherein the quantum processing die includes one or more Josephson junctions, or the quantum processing die includes a quantum well stack.

### Claim 13 (depends on 1)

The QC assembly of claim 1, wherein individual ones of the air gaps are fluidly coupled to one or more external openings in the flexible interconnect.

### Claim 14 (depends on 1)

The QC assembly of claim 1, wherein the shield structure includes a plurality of rectangular sleeves.

### Claim 15 (depends on 14)

The QC assembly of claim 14, wherein the plurality of rectangular sleeves each include at least one opening fluidly coupled to one or more external openings.

### Claim 16 (depends on 1)

The QC assembly of claim 1, wherein a portion of dielectric material is between individual ones of the transmission lines and a proximate surface of the shield structure.

### Claim 17 (depends on 1)

The QC assembly of claim 1, wherein the shield structure includes portions of dielectric material surrounding individual transmission lines and a metal surrounding individual portions of dielectric material.

### Claim 18 (depends on 17)

The QC assembly of claim 17, wherein an air gap is between at least one adjacent pair of portions of dielectric material.

### Claim 19 (depends on 17)

The QC assembly of claim 17, wherein the metal includes a superconductor.

### Claim 20 (depends on 17)

The QC assembly of claim 17, wherein the metal includes a planar portion under the portion of dielectric material and a conformal portion over the portion of dielectric material.

### Claim 21

A quantum computing (QC) assembly, comprising:
a quantum processing die; and
a flexible interconnect electrically coupled to the quantum processing die, wherein the flexible interconnect includes a plurality of transmission lines and a shield structure to mitigate cross-talk between the transmission lines, and the shield structure includes an air gap.

### Claim 22 (depends on 21)

The QC assembly of claim 21, wherein the plurality of transmission lines have a longitudinal portion and at least one transverse portion.

### Claim 23 (depends on 22)

The QC assembly of claim 22, wherein the shield structure includes a plurality of rectangular sleeves in the longitudinal portion, and a plurality of hexagonal sleeves in the transverse portion.

### Claim 24 (depends on 21)

The QC assembly of claim 21, wherein the air gap is fluidly coupled to one or more external openings in the flexible interconnect.

### Claim 25 (depends on 21)

The QC assembly of claim 21, wherein the shield structure includes a metal.