# US 10,319,892 B2 · Light-emitting element mounting substrate and method for manufacturing light-emitting element mounting substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,892 B2 - Document ID: US10319892B2 - Status: Granted - Kind: B2 - Application number: 15/894,009 - Filed: 2018-02-12 - Published: 2018-08-16 - Granted: 2019-06-11 - Earliest claimed: 2017-02-10 - Assignees: Ibiden Co., Ltd. - Applicants: Ibiden Co., Ltd. - Inventors: Takahisa Hirasawa; Kiyotaka Tsukada - Web page: https://patentgrep.com/patent/US10319892B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8506: {Containers} - H10H 20/856: Reflecting means - H10H 20/8585: {being an interconnection} - H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] - H10W 20/43: Layouts of interconnections - H10W 70/095: {of vias therein} - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/0206: {by printed thermal vias} - H10H 20/0364: {of interconnections} - H10H 20/0365: {of means for heat extraction or cooling} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A light-emitting element mounting substrate includes a substrate including insulating resin, a first conductor layer formed on a first surface of the substrate and having an element mounting portion, a second conductor layer formed on a second surface of the substrate on the opposite side of the first surface, metal blocks formed such that the metal blocks are penetrating through the first conductor layer, the substrate and the second conductor layer and positioned in the element mounting portion of the first conductor layer, and through-hole conductors formed adjacent to the metal blocks respectively such that the through-hole conductors electrically connect the first conductor layer and the second conductor layer and that a diameter of each metal block is larger than a diameter of each through-hole conductor. ## Claims ### Claim 1 A light-emitting element mounting substrate, comprising: a substrate comprising insulating resin; a first conductor layer formed on a first surface of the substrate and having an element mounting portion; a second conductor layer formed on a second surface of the substrate on an opposite side of the first surface; a plurality of metal blocks formed such that the plurality of metal blocks is penetrating through the first conductor layer, the substrate and the second conductor layer and positioned in the element mounting portion of the first conductor layer; and a plurality of through-hole conductors formed adjacent to the plurality of metal blocks respectively such that the plurality of through-hole conductors electrically connects the first conductor layer and the second conductor layer and that a diameter of each metal block is larger than a diameter of each through-hole conductor, wherein the first conductor layer is formed such that when a light-emitting element is mounted on the element mounting portion, the plurality of metal blocks is positioned directly below the light-emitting element on the element mounting portion, each of the metal blocks has an end surface in a rectangular shape such that the diameter of each metal block is a diagonal length of the end surface in the rectangular shape, each of the through-hole conductors has an end surface in a circular shape such that the diameter of each through-hole conductor is a diameter of the end surface in the circular shape, the plurality of metal blocks and the plurality of through-hole conductors are formed such that a ratio of the diameter of the metal blocks to the diameter of the through-hole conductors is in a range of 1.5 to 7.5, the plurality of through-hole conductors is formed such that the diameter of the through-hole conductors is in a range of 0.2 mm to 1.0 mm, and the plurality of metal blocks is formed such that the diameter of the metal blocks is in a range of 0.3 mm to 4.0 mm. ### Claim 2 (depends on 1) A light-emitting element mounting substrate according to claim 1, wherein the plurality of metal blocks and the plurality of through-hole conductors are formed such that each of the metal blocks has a same potential with respect to an adjacent one of the through-hole conductors. ### Claim 3 (depends on 1) A light-emitting element mounting substrate according to claim 1, wherein the plurality of through-hole conductors is formed such that the plurality of through-hole conductors forms a plurality of positioning holes formed to position the plurality of metal blocks. ### Claim 4 (depends on 1) A light-emitting element mounting substrate according to claim 1, wherein the plurality of metal blocks and the plurality of through-hole conductors are formed such that a conductor volume ratio of a conductor volume of each metal block to a conductor volume of each through-hole conductor is 10 or greater. ### Claim 5 (depends on 1) A light-emitting element mounting substrate according to claim 1, wherein the first conductor layer is formed such that the element mounting portion is formed in a plurality, that the plurality of metal blocks is formed at each element mounting portion, and that one of the through-hole conductors is formed between one element mounting portion and an adjacent element mounting portion and another one of the through-hole conductors is formed between the one element mounting portion and another adjacent element mounting portion. ### Claim 6 (depends on 1) A light-emitting element mounting substrate according to claim 1, further comprising: a metal plating layer formed on a surface of the first conductor layer and end surface of the metal blocks on a first conductor layer side. ### Claim 7 (depends on 1) A light-emitting element mounting substrate according to claim 1, further comprising: a light-reflecting layer forming an outermost surface on a first conductor layer side such that the light-reflecting layer is exposing the element mounting portion of the first conductor layer. ### Claim 8 (depends on 6) A light-emitting element mounting substrate according to claim 6, wherein the plurality of metal blocks and the plurality of through-hole conductors are formed such that each of the metal blocks has a same potential with respect to an adjacent one of the through-hole conductors. ### Claim 9 (depends on 6) A light-emitting element mounting substrate according to claim 6, wherein the plurality of through-hole conductors is formed such that the plurality of through-hole conductors forms a plurality of positioning holes formed to position the plurality of metal blocks. ### Claim 10 (depends on 2) A light-emitting element mounting substrate according to claim 2, wherein the plurality of through-hole conductors is formed such that the plurality of through-hole conductors forms a plurality of positioning holes formed to position the plurality of metal blocks. ### Claim 11 (depends on 2) A light-emitting element mounting substrate according to claim 2, wherein the plurality of metal blocks and the plurality of through-hole conductors are formed such that a conductor volume ratio of a conductor volume of each metal block to a conductor volume of each through-hole conductor is 10 or greater. ### Claim 12 (depends on 2) A light-emitting element mounting substrate according to claim 2, wherein the first conductor layer is formed such that the element mounting portion is formed in a plurality, that the plurality of metal blocks is formed at each element mounting portion, and that one of the through-hole conductors is formed between one element mounting portion and an adjacent element mounting portion and another one of the through-hole conductors is formed between the one element mounting portion and another adjacent element mounting portion. ### Claim 13 (depends on 3) A light-emitting element mounting substrate according to claim 3, wherein the plurality of metal blocks and the plurality of through-hole conductors are formed such that a conductor volume ratio of a conductor volume of each metal block to a conductor volume of each through-hole conductor is 10 or greater. ### Claim 14 (depends on 3) A light-emitting element mounting substrate according to claim 3, wherein the first conductor layer is formed such that the element mounting portion is formed in a plurality, that the plurality of metal blocks is formed at each element mounting portion, and that one of the through-hole conductors is formed between one element mounting portion and an adjacent element mounting portion and another one of the through-hole conductors is formed between the one element mounting portion and another adjacent element mounting portion. ### Claim 15 (depends on 4) A light-emitting element mounting substrate according to claim 4, further comprising: a metal plating layer formed on a surface of the first conductor layer and end surface of the metal blocks on a first conductor layer side. ### Claim 16 (depends on 5) A light-emitting element mounting substrate according to claim 5, further comprising: a metal plating layer formed on a surface of the first conductor layer and end surface of the metal blocks on a first conductor layer side. ### Claim 17 (depends on 6) A light-emitting element mounting substrate according to claim 6, further comprising: a light-reflecting layer forming an outermost surface on a first conductor layer side such that the light-reflecting layer is exposing the element mounting portion of the first conductor layer. ### Claim 18 A method for manufacturing a light-emitting element mounting substrate, comprising: preparing a double-sided conductor substrate comprising a substrate comprising insulating resin, a first conductor layer formed on a first surface of the substrate, and a second conductor layer formed on a second surface of the substrate on an opposite side of the first surface; forming a plurality of positioning holes in the double-sided conductor substrate such that each of the positioning holes penetrates through the first conductor layer, the substrate and the second conductor layer; forming a plurality of holes in an element mounting portion of the first conductor layer such that each of the holes penetrates through the first conductor layer, the substrate and the second conductor layer and has a diameter that is larger than a diameter of each positioning hole; inserting a plurality of metal blocks into the plurality of holes respectively using the positioning holes as reference positions such that the metal blocks fill in the holes in the element mounting portion of the first conductor layer; and applying metal plating to the positioning holes such that a plurality of through-hole conductors is formed in the plurality of positioning holes respectively and electrically connects the first conductor layer and the second conductor layer, wherein the first conductor layer is formed such that when a light-emitting element is mounted on the element mounting portion, the plurality of metal blocks is positioned directly below the light-emitting element on the element mounting portion, each of the metal blocks has an end surface in a rectangular shape such that the diameter of each metal block is a diagonal length of the end surface in the rectangular shape, each of the through-hole conductors has an end surface in a circular shape such that the diameter of each through-hole conductor is a diameter of the end surface in the circular shape, the plurality of metal blocks and the plurality of through-hole conductors are formed such that a ratio of the diameter of the metal blocks to the diameter of the through-hole conductors is in a range of 1.5 to 7.5, the plurality of through-hole conductors is formed such that the diameter of the through-hole conductors is in a range of 0.2 mm to 1.0 mm, and the plurality of metal blocks is formed such that the diameter of the metal blocks is in a range of 0.3 mm to 4.0 mm. ### Claim 19 (depends on 18) A method for manufacturing a light-emitting element mounting substrate according to claim 18, wherein the forming of the positioning holes and the forming of the holes are conducted simultaneously in a same process. ### Claim 20 (depends on 18) A method for manufacturing a light-emitting element mounting substrate according to claim 18, wherein the forming of the holes comprises punching the plurality of holes through the double-sided conductor substrate, and the inserting of the metal blocks comprises inserting the metal blocks into the holes from a surface of the double-sided conductor substrate on an opposite side with respect to a surface of the double-sided conductor substrate upon which the punching of the holes is applied.