# US 10,319,888 B2 · Method of manufacturing light emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,888 B2 - Document ID: US10319888B2 - Status: Granted - Kind: B2 - Application number: 15/350,330 - Filed: 2016-11-14 - Published: 2017-03-02 - Granted: 2019-06-11 - Earliest claimed: 2009-01-30 - Assignees: Nichia Corporation - Applicants: Nichia Corporation - Inventors: Mototaka Inobe; Motokazu Yamada; Kazuhiro Kamada - Web page: https://patentgrep.com/patent/US10319888B2 ## CPC - H10H 20/856: Reflecting means - H10H 20/819: characterised by their shape, e.g. curved or truncated substrates - H10H 20/825: containing nitrogen, e.g. GaN - H10H 20/852: Encapsulations - H10H 20/853: characterised by their shape - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/0362: {of encapsulations} - H10H 20/0363: {of optical field-shaping means} - H10H 20/0364: {of interconnections} - H10W 72/01515: {Forming coatings} - H10W 72/075: {of bond wires} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/5522: {comprising gold [Au]} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/00: Package configurations - H10W 90/753: {between laterally-adjacent chips} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of manufacturing a light emitting device including providing a light emitting element mounted on a substrate. The light emitting element is provided within a first cavity of the light emitting device. The method further includes covering continuously, with insulating material, at least side surfaces of the light emitting element. Light reflective resin is provided over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element. ## Claims ### Claim 1 A method of manufacturing a light emitting device, the method comprising: providing a light emitting element mounted on a substrate, the light emitting element being provided within a first cavity of the light emitting device; covering continuously, with insulating material, at least side surfaces of the light emitting element; providing light reflective resin directly over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element; and filling an inside surrounded by the light reflective resin with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element. ### Claim 2 (depends on 1) The method of claim 1, further comprising: establishing metallization on an upper surface of the substrate; and mounting the light emitting element on top of the metallization, and connecting electrically the metallization and light emitting element; wherein the insulating material continuously covers surfaces of metallization. ### Claim 3 (depends on 1) The method of claim 1, wherein said providing the light reflective resin comprises forming the light reflective resin to protrude from a horizontal plane higher than the light emitting element. ### Claim 4 (depends on 2) The method of claim 2, wherein said mounting the light emitting element comprises connecting electrically the metallization and light emitting element with conducting wire, and wherein said covering with insulating material comprises covering continuously, with insulating material, the surfaces of metallization, the side surface and an upper surface of the light emitting element, and the conducting wire. ### Claim 5 (depends on 1) The method of claim 1, wherein said providing the substrate comprises forming the substrate in approximately sheet form to establish an approximately planar surface of the substrate for mounting the light emitting element on, and wherein said providing the light reflective resin comprises providing the light reflective resin on a same horizontal surface of the substrate where the light emitting element is mounted. ### Claim 6 (depends on 2) The method of claim 2, wherein said providing the substrate comprises forming the substrate in a manner that defines the first cavity; a second cavity inside the first cavity with a bottom surface positioned below the first cavity; and a mounting surface surrounded by the second cavity, the mounting surface being higher than the bottom surface of the second cavity, wherein said establishing metallization comprises establishing metallization on the mounting surface of the substrate and the bottom surface of the second cavity, wherein said mounting the light emitting element comprises mounting the light emitting element on top of the metallization established on the mounting surface of the substrate, wherein said covering with the insulating material comprises covering continuously, with insulating material, the surfaces of metallization on the bottom surfaces inside the second cavity, an inside wall that joins with the first cavity, the surface of metallization on the mounting surface in the first cavity, and at least side surface of the light emitting element, and wherein said providing the light reflective resin comprises providing the light reflective resin in the second cavity to reflect light from the light emitting element. ### Claim 7 (depends on 6) The method of claim 6, wherein said mounting the light emitting element comprises connecting electrically the metallization and light emitting element with conducting wire, and wherein said covering with insulating material comprises covering continuously, with insulating material, the surfaces of metallization, the side surface and an upper surface of the light emitting element, and the conducting wire. ### Claim 8 (depends on 1) The method of claim 1, wherein said light emitting element comprises nitride semiconductor made of InXAlYGa1-X-YN (0≤X, 0≤Y, X+Y≤1). ### Claim 9 (depends on 1) The method of claim 1, wherein side-walls of the light reflective resin form the first cavity. ### Claim 10 (depends on 1) The method of claim 1, wherein the substrate includes: a first member that is made of insulating substance; and a second member which is made of insulating substance, the second member being dimensioned smaller than the first member and laminated on the first member. ### Claim 11 (depends on 1) The method of claim 1, wherein providing light reflective resin is in direct contact with the insulating material at the position surrounding the light emitting element. ### Claim 12 (depends on 1) The method of claim 1, wherein the insulating material is provided directly beneath an entirety of the light reflective resin. ### Claim 13 (depends on 1) The method of claim 1, wherein light reflective resin is provided to surround the light emitting element to form an enclosed region, and wherein the insulating material extends directly beneath the light reflective resin from an inner edge of the light reflective resin at the enclosed region to an outer edge of the light reflective resin.