# US 10,319,886 B2 · LED assembly for omnidirectional light appliances > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,886 B2 - Document ID: US10319886B2 - Status: Granted - Kind: B2 - Application number: 15/955,652 - Filed: 2018-04-17 - Published: 2018-08-16 - Granted: 2019-06-11 - Earliest claimed: 2013-10-07 - Assignees: Epistar Corporation; Kaistar Lighting (Xiamen) Co., Ltd. - Applicants: Huga Optotech Inc.; Interlight Optotech Corporation - Inventors: Tzer-Perng Chen; Tzu-Chi Cheng - Web page: https://patentgrep.com/patent/US10319886B2 ## CPC - H10H 20/8513: {having two or more wavelength conversion materials} - H10H 20/8506: {Containers} - H10H 20/8515: {not being in contact with the bodies} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 72/07554: {changes in dispositions} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/547: {Dispositions of multiple bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/753: {between laterally-adjacent chips} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip. ## Claims ### Claim 1 An LED assembly, comprising: a substrate comprising a first top surface; a mount, comprising a second top surface and a bottom surface which is opposite to the second top surface, wherein the mount is positioned on the first top surface in a configuration of forming a recess; a first LED chip, comprising a third top surface, and arranged on the first top surface and in the recess; a second LED chip formed in the recess; an electrode plate, comprising a fourth top surface, arranged on the second top surface, and electrically connected to the first LED chip; and a layer, comprising a phosphor, and covering the first LED chip, the second LED chip, the first top surface, and the electrode plate, wherein the fourth top surface is higher than the third top surface in an elevation from the first top surface. ### Claim 2 (depends on 1) The LED assembly of claim 1, further comprising a second bonding wire electrically connected to the first LED chip and the second LED chip. ### Claim 3 (depends on 2) The LED assembly of claim 2, wherein the layer covers the second bonding wire. ### Claim 4 (depends on 1) The LED assembly of claim 1, wherein the layer is filled between the first LED chip and the second LED chip. ### Claim 5 (depends on 1) An LED bulb, comprising: an LED assembly of claim 1; a holding element physically connected to the first electrode plate; and a transparent cover covering the LED assembly. ### Claim 6 (depends on 5) The LED bulb of claim 5, wherein the holding element comprises a clamp configured to fasten the LED assembly. ### Claim 7 (depends on 5) The LED bulb of claim 5, wherein the holding element comprises a solid strip. ### Claim 8 (depends on 7) The LED bulb of claim 7, wherein the solid strip comprises a notch. ### Claim 9 An LED assembly, comprising: a substrate comprising a first top surface; a mount, comprising a second top surface and a bottom surface which is opposite to the second top surface, wherein the mount is positioned on the first top surface in a configuration of forming a recess; a glue layer arranged between the substrate and the mount; a first LED chip, comprising a third top surface, and arranged on the first top surface and in the recess; an electrode plate, comprising a fourth top surface, arranged on the second top surface, and electrically connected to the first LED chip; and a layer, comprising a phosphor, and covering the first LED chip, the first top surface, and the electrode plate, wherein the fourth top surface is higher than the third top surface in an elevation from the first top surface. ### Claim 10 (depends on 9) The LED assembly of claim 9, wherein the glue layer directly contacts the substrate and the mount. ### Claim 11 (depends on 9) The LED assembly of claim 9, wherein the first LED chip comprises a plurality of LED cells formed on a common substrate. ### Claim 12 (depends on 9) An LED bulb, comprising: an LED assembly of claim 9; a holding element physically connected to the first electrode plate; and a transparent cover covering the LED assembly. ### Claim 13 (depends on 12) The LED bulb of claim 12, wherein the holding element comprises a clamp configured to fasten the LED assembly. ### Claim 14 An LED assembly, comprising: a substrate comprising a first top surface; a mount, comprising a second top surface and a bottom surface which is opposite to the second top surface, wherein the mount is positioned on the first top surface in a configuration of forming a recess; a first LED chip, comprising a third top surface, and arranged on the first top surface and in the recess; an electrode plate, comprising a fourth top surface, arranged on the second top surface, and electrically connected to the first LED chip; and a layer having a curved surface, comprising a phosphor, and covering the first LED chip, the first top surface, and the electrode plate, wherein the fourth top surface is higher than the third top surface in an elevation from the first top surface. ### Claim 15 (depends on 14) The LED assembly of claim 14, wherein the layer directly contact a portion of the second top surface. ### Claim 16 (depends on 14) The LED assembly of claim 14, further comprising a first bonding wire electrically connected to the first LED chip and the electrode plate. ### Claim 17 (depends on 14) The LED assembly of claim 14, wherein the first LED chip comprises a plurality of LED cells formed on a common substrate. ### Claim 18 (depends on 14) An LED bulb, comprising: an LED assembly of claim 14; a holding element physically connected to the first electrode plate; and a transparent cover covering the LED assembly. ### Claim 19 (depends on 18) The LED bulb of claim 18, wherein the holding element is electrically connected to the electrode plate. ### Claim 20 (depends on 18) The LED bulb of claim 18, wherein the LED bulb is configured to produce an omnidirectional light.