# US 10,319,811 B2 · Semiconductor device including fin having condensed channel region > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,811 B2 - Document ID: US10319811B2 - Status: Granted - Kind: B2 - Application number: 14/949,977 - Filed: 2015-11-24 - Published: 2017-02-02 - Granted: 2019-06-11 - Earliest claimed: 2015-07-27 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Hong He; Effendi Leobandung; Gen Tsutsui; Tenko Yamashita - Web page: https://patentgrep.com/patent/US10319811B2 ## CPC - H10D 62/115: {Dielectric isolations, e.g. air gaps} - H10D 30/024: {of fin field-effect transistors [FinFET]} - H10D 30/62: Fin field-effect transistors [FinFET] - H10D 30/751: {having composition variations in the channel regions} - H10D 30/797: {being in source or drain regions, e.g. SiGe source or drain} - H10D 62/832: being Group IV materials comprising two or more elements, e.g. SiGe - H10D 64/017: {using dummy gates in processes wherein at least parts of the final gates are self-aligned to the dummy gates, i.e. replacement gate processes} - H10P 14/40: of conductive or resistive materials - H10P 50/283: {by chemical means} - H10D 30/6219: {characterised by the source or drain electrodes} - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A finFET semiconductor device includes at least one semiconductor fin on an upper surface of a substrate. The semiconductor fin includes a channel region interposed between opposing source/drain regions. A gate stack is on the upper surface of the substrate and wraps around sidewalls and an upper surface of only the channel region. The channel region further includes a condensed portion formed of a first semiconductor material and a second semiconductor material. The source/drain regions are formed of the first semiconductor material while excluding the second semiconductor material. ## Claims ### Claim 1 A method of fabricating a finFET device, the method comprising: forming, on an upper surface of a semiconductor substrate, at least one semiconductor fin comprising a first semiconductor material, the at least one semiconductor fin having a channel region interposed between opposing source/drain regions; forming first and second opposing gate spacers that wrap around the exterior surface of the at least one fin and define a gate region that extends between the first and second gate spacers to define a total gate region length; forming a flowable insulator layer on the source/drain regions, and forming a dummy gate stack on the channel region; selectively removing the dummy gate stack with respect to the flowable insulator layer to expose the channel region; forming a condenser layer including a donor material directly on an upper surface and sidewalls of the exposed channel region; performing a condensation process to selectively transform the entire exposed channel region into a second semiconductor material different from the first semiconductor material so as to form a condensed channel region configured to increase carrier mobility conductivity of the channel region, while maintaining the first semiconductor material of the source/drain regions, wherein the condensed channel region is comprised entirely of the second semiconductor material, and wherein the second semiconductor material has a total condensed channel length extending continuously across an entire upper surface of the channel region from an inner side of the first gate spacer to an inner side of the second gate spacer that matches the gate region length, and wherein the second semiconductor material directly contacts the first and second gate spacers, and wherein the source/drain regions excludes the donor material that is condensed to form the condensed channel region. ### Claim 2 (depends on 1) The method of claim 1, wherein the condensation process comprises: condensing the exposed channel region in response to driving the donor material from the condenser layer into the exposed channel region to convert the first semiconductor material into the second semiconductor material while converting the condenser layer into an oxidized layer comprising an insulator material. ### Claim 3 (depends on 2) The method of claim 2, wherein forming the condenser layer includes epitaxially growing the condenser layer from the external surface of the exposed channel region. ### Claim 4 (depends on 2) The method of claim 2, wherein the first semiconductor material is silicon (Si). ### Claim 5 (depends on 4) The method of claim 4, wherein the condenser layer comprises a donee material that is maintained in the condenser layer during the condensation process. ### Claim 6 (depends on 5) The method of claim 5, wherein the first semiconductor material of the channel region is silicon (Si) and the donor material is germanium such that the second semiconductor material resulting from the condensation process is silicon germanium (SiGe). ### Claim 7 (depends on 6) The method of claim 6, wherein condensing the exposed channel region includes exposing the channel region to oxygen (O2) ions that chemically interact with the donee material so as to convert the condenser layer comprising SiGe into the condensed insulator layer comprising SiO2. ### Claim 8 (depends on 2) The method of claim 2, further comprising performing a selective etching process that attacks the insulator material with respect to the second semiconductor material so as to remove the condensed insulator layer from the condensed channel region. ### Claim 9 (depends on 8) The method of claim 8, further comprising forming a metal gate structure on the semiconductor substrate, the metal gate structure wrapping around all exposed sides of the condensed channel region. ### Claim 10 (depends on 9) The method of claim 9, wherein the substrate includes a semiconductor-on-insulator (SOI) substrate. ### Claim 11 (depends on 10) The method of claim 10, wherein the condenser layer is excluded from a buried insulator layer of the SOI substrate such the exposed channel area is condensed with respect to the buried insulator layer. ### Claim 12 (depends on 11) The method of claim 11, wherein the condensed channel region is formed directly on the buried insulator layer. ### Claim 13 (depends on 1) The method of claim 1, further comprising forming, between the first and second spacers, an electrically conductive gate structure having a gate length, wherein the condensed channel length of the second semiconductor material is equal to the gate length. ### Claim 14 (depends on 13) The method of claim 13, wherein the condensation process forms the second material that extends continuously from a first edge to a second edge, and wherein the first edge of the second material is formed directly against the first gate spacer and the second edge of the second material opposite the first edge is formed directly against the second gate spacer. ### Claim 15 A method of fabricating a finFET device, the method comprising: forming, on an upper surface of a semiconductor-on-insulator (SOI) substrate, at least one semiconductor fin comprising a first semiconductor material, the at least one semiconductor fin having a channel region interposed between opposing source/drain regions; forming first and second opposing gate spacers that wrap around the exterior surface of the at least one fin and define a gate region that extends between the first and second gate spacers to define a total gate region length; forming a flowable insulator layer on the source/drain regions, and forming a dummy gate stack on the channel region; selectively removing the dummy gate stack with respect to the flowable insulator layer to expose the channel region; and performing a condensation process to selectively transform the entire exposed channel region into a second semiconductor material different from the first semiconductor material so as to form a condensed channel region configured to increase carrier mobility conductivity of the channel region, while maintaining the first semiconductor material of the source/drain regions, the condensation process further comprising: forming a condenser layer including a donor material on an external surface of the exposed channel region; and condensing the exposed channel region in response to drive the donor material from the condenser layer into the exposed channel region to convert the first semiconductor material into the second semiconductor material while converting the condenser layer into an oxidized layer comprising an insulator material, wherein the condenser layer is excluded from a buried insulator layer of the SOI substrate such the exposed channel area is entirely condensed with respect to the buried insulator layer, and wherein the condensed channel region is comprised entirely of the second semiconductor material, and wherein the second semiconductor material has a condensed channel length extending continuously across an entire upper surface of the channel region from an inner side of the first gate spacer to an inner side of the second gate spacer that matches the gate region length, and wherein the second semiconductor material directly contacts the first and second gate spacers, and wherein the source/drain regions excludes the donor material that is condensed to form the condensed channel region. ### Claim 16 (depends on 15) The method of claim 15, further comprising forming, between the first and second spacers, an electrically conductive gate structure having a gate length, wherein the condensed channel length of the second semiconductor material is equal to the gate length.