# US 10,319,782 B2 · Maskless parallel pick-and-place transfer of micro-devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,782 B2 - Document ID: US10319782B2 - Status: Granted - Kind: B2 - Application number: 16/194,176 - Filed: 2018-11-16 - Published: 2019-04-04 - Granted: 2019-06-11 - Earliest claimed: 2016-06-10 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Manivannan Thothadri; Robert Jan Visser - Web page: https://patentgrep.com/patent/US10319782B2 ## CPC - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - H05K 3/0026: {by laser ablation} - H05K 3/305: {Affixing by adhesive} - H05K 13/0015: {Orientation; Alignment; Positioning} - H05K 13/0069: {Holders for printed circuit boards} - H05K 13/0469: {by applying a glue or viscous material} - H10H 20/01: Manufacture or treatment - H10H 20/856: Reflecting means - H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates} - H10P 72/74: {using temporarily an auxiliary support} - H10W 90/00: Package configurations - H10H 20/036: {of packages} - H10H 20/819: characterised by their shape, e.g. curved or truncated substrates - H10H 20/85: Packages - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10P 72/7414: {the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support} - H10P 72/7434: {used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate} - H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of surface mounting micro-devices includes adhering a first plurality of micro-devices on a donor substrate to a transfer surface with an adhesive layer, removing the first plurality of micro-devices from donor substrate while the first plurality of micro-devices remain adhered to the transfer surface, positioning the transfer surface relative to a destination substrate so that a subset of the plurality of micro-devices on the transfer surface abut a plurality of receiving positions on the destination substrate, the subset including one or more micro-devices but less than all of micro-devices of the plurality of micro-devices, selectively neutralizing one or more of regions of the adhesive layer on the transfer surface corresponding to the subset of micro-device to light to detach the subset of micro-devices from the adhesive layer, and separating the transfer surface from the destination substrate such that the subset of micro-devices remain on the destination substrate. ## Claims ### Claim 1 A method of surface mounting micro-devices, comprising: adhering a plurality of micro-devices on a donor substrate to a transfer surface with an adhesive layer; removing the plurality of micro-devices from the donor substrate while the plurality of micro-devices remain adhered to the transfer surface; positioning the transfer surface relative to a destination substrate so that at least some of the plurality of micro-devices on the transfer surface abut at least some of a plurality of receiving positions on the destination substrate; selectively and masklessly exposing a plurality of regions of the adhesive layer on the transfer surface corresponding to a subset of micro-devices to light to detach the subset of micro-devices from the adhesive layer, the subset including multiple micro-devices but less than all of micro-devices of the plurality of micro-devices; and separating the transfer surface from the destination substrate such that the subset of micro-devices remain on the destination substrate. ### Claim 2 (depends on 1) The method of claim 1, wherein the plurality of micro devices comprise all of the micro-devices on the donor substrate. ### Claim 3 (depends on 1) The method of claim 1, wherein the plurality of micro-devices are disposed in a first array on the transfer surface, and the plurality of receiving positions are disposed in a second array on the destination substrate. ### Claim 4 (depends on 3) The method of claim 3, wherein a spatial density of the first array is greater than a spatial density of the second array. ### Claim 5 (depends on 4) The method of claim 4, wherein the first array is first rectangular array with cells for the plurality of micro-devices disposed at a first pitch PX1 along a first axis and a second pitch PY1 along a second axis perpendicular to the first axis, and the second array is a second rectangular array with the receiving positions disposed at a third pitch PX2 along the first axis and a fourth pitch PY2 along the second axis perpendicular to the first axis. ### Claim 6 (depends on 5) The method of claim 5, wherein the third pitch PX2 is an integer multiple of the first pitch PX1 and the fourth pitch PY2 is an integer multiple of the second pitch PY1. ### Claim 7 (depends on 6) The method of claim 6, wherein the donor substrate is a donor substrate on which the plurality of micro-devices were fabricated. ### Claim 8 (depends on 1) The method of claim 1, wherein the micro-devices comprise micro-LEDs. ### Claim 9 (depends on 1) The method of claim 1, wherein selectively exposing the plurality of regions comprises directing light to a digital mirror device and actuating selected mirrors of the digital mirror device to reflect light to the plurality of regions. ### Claim 10 (depends on 9) The method of claim 9, comprising exposing a first portion of the plurality of regions, thereafter moving the digital mirror device relative to the adhesive layer, and thereafter exposing a second portion of the plurality regions. ### Claim 11 (depends on 10) The method of claim 10, wherein digital mirror device comprises a linear array of mirrors. ### Claim 12 (depends on 10) The method of claim 10, wherein digital mirror device comprises a two-dimensional array of mirrors. ### Claim 13 (depends on 1) The method of claim 1, further comprising disposing a passivating layer over the subset of micro-devices on the destination substrate. ### Claim 14 (depends on 1) The method of claim 1, wherein positioning the transfer surface comprises moving a transfer body having the transfer surface relative to the destination substrate. ### Claim 15 (depends on 14) The method of claim 14, comprising removably holding and moving the transfer body with a robotic arm.