# US 10,319,772 B2 · Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,772 B2 - Document ID: US10319772B2 - Status: Granted - Kind: B2 - Application number: 15/008,077 - Filed: 2016-01-27 - Published: 2016-05-19 - Granted: 2019-06-11 - Earliest claimed: 2004-10-26 - Assignees: Sony Corporation - Applicants: Sony Corporation - Inventors: Ikuo Yoshihara; Masamitsu Yamanaka - Web page: https://patentgrep.com/patent/US10319772B2 ## CPC - H10F 39/809: {of hybrid image sensors} - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H10F 39/026: {Wafer-level processing} - H10F 39/199: {Back-illuminated image sensors} - H10F 39/804: {Containers or encapsulations} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10F 77/60: Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract A semiconductor image sensor module 1 at least includes a semiconductor image sensor chip 2 having a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chip 3 for processing image signals formed in the semiconductor image sensor chip 2, wherein a plurality of bump electrodes 15a are formed on a first main surface, a plurality of bump electrodes 15b are formed on the image signal processing chip 3, both the chips 2 and 3 are formed to be laminated through heat dissipating means 4 and the plurality of bump electrodes 15a of the semiconductor image sensor chip 2 and the plurality of bump electrodes 15b on the image signal processing chip 3 are electrically connected. ## Claims ### Claim 1 An imaging unit comprising: a back-illuminated semiconductor image sensor including a first substrate coupled to a second substrate, the first substrate including an image sensor and the second substrate including an image processing unit, wherein a first electrode and a second electrode are formed on a surface of the first substrate, a third electrode and a fourth electrode are formed on a surface of the second substrate, an intermediate layer is formed between the first substrate and the second substrate, the first electrode is electrically connected to the third electrode through the intermediate layer by a first conductive electrode formed in a first through-hole, the second electrode is electrically connected to the fourth electrode through the intermediate layer by a second conductive electrode formed in a second through-hole, the intermediate layer includes a heat dissipating unit, the heat dissipating unit is formed of a heat-conducting layer formed of a heat-conducting material, and the intermediate layer further includes a heat-insulating layer formed of a heat-insulative material, the heat-conducting layer is between the surface of the first substrate and the heat-insulating layer, wherein, within the first through-hole and the second through-hole, an insulative material is formed around the first conductive electrode and the second conductive electrode. ### Claim 2 (depends on 1) The imaging unit according to claim 1, wherein the first electrode, second electrode, third electrode, and fourth electrode are bump electrodes. ### Claim 3 An imaging unit comprising: a first substrate that includes an image sensor, a first electrode extends from a surface of the first substrate to an intermediate electrode; a second substrate that includes an image processing unit, a second electrode extends from a surface of the second substrate to the intermediate electrode; and an intermediate layer between the surface of the first substrate and the surface of the second substrate, a through-hole extends through the intermediate layer, wherein the intermediate electrode and an insulative material are in the through-hole, the insulative material surrounds the intermediate electrode to electrically insulate the intermediate layer from the intermediate electrode. ### Claim 4 (depends on 3) The imaging unit according to claim 3, wherein the image sensor is a back-illuminated semiconductor image sensor. ### Claim 5 (depends on 3) The imaging unit according to claim 3, wherein the intermediate layer includes a heat-conducting layer, the heat-conducting layer is formed from a heat-conducting material. ### Claim 6 (depends on 3) The imaging unit according to claim 3, wherein the intermediate layer includes a heat-insulating layer, the heat-insulating layer is formed from a heat-insulating material. ### Claim 7 (depends on 6) The imaging unit according to claim 6, wherein the heat-insulating layer is between the first substrate and the heat-conducting layer. ### Claim 8 (depends on 6) The imaging unit according to claim 6, wherein the heat-conducting layer is between the second substrate and the heat-insulating layer. ### Claim 9 (depends on 3) The imaging unit according to claim 3, wherein the first electrode is a bump electrode. ### Claim 10 (depends on 9) The imaging unit according to claim 9, wherein the second electrode is another bump electrode. ### Claim 11 (depends on 3) The imaging unit according to claim 3, wherein the intermediate electrode electrically connects the image sensor directly to the image processing unit. ### Claim 12 (depends on 3) The imaging unit according to claim 3, wherein the intermediate layer includes a U-shaped structure, the through-hole extends through the U-shaped structure. ### Claim 13 (depends on 12) The imaging unit according to claim 12, wherein a heat dissipating unit is between arms of the U-shaped structure. ### Claim 14 (depends on 12) The imaging unit according to claim 12, wherein the U-shaped structure is a silicon interposer.