# US 10,319,767 B2 · Electronic component including an optical member fixed with adhesive > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,767 B2 - Document ID: US10319767B2 - Status: Granted - Kind: B2 - Application number: 15/587,631 - Filed: 2017-05-05 - Published: 2017-11-23 - Granted: 2019-06-11 - Earliest claimed: 2016-05-19 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: Kazuya Notsu; Koji Tsuduki; Kunihiro Abe - Web page: https://patentgrep.com/patent/US10319767B2 ## CPC - H10F 39/8063: {Microlenses} - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H10F 39/804: {Containers or encapsulations} - H10F 39/806: {Optical elements or arrangements associated with the image sensors} - H10W 72/884: {Die-attach connectors and bond wires} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An optical member includes a first region and a second region constituting an interface with an adhesive member. The first region is disposed outside the second region in a second direction intersecting a first direction. An adhesive force generated at an interface between the first region and the adhesive member is smaller than an adhesive force generated at an interface between the second region and the adhesive member. ## Claims ### Claim 1 An electronic component comprising: an electronic device; a mount member to which the electronic device is fixed; an optical member facing the electronic device in a first direction; and an adhesive member disposed between the optical member and the mount member to bond the optical member and the mount member together, wherein the optical member comprises a base material and a film disposed between the base material and the adhesive member, wherein the optical member further comprises a first region and a second region, the first region being disposed outside the second region in a second direction intersecting the first direction, the second region being constituted by the base material and the film, the first region being constituted by the base material, the first region and the second region constituting an interface with the adhesive member, wherein a length L1 of the first region in the second direction satisfies 0.1 mm≤L1<0.5 mm, and a length L2 of the second region in the second direction satisfies 0.5 mm≤L2≤2.5 mm, and wherein an adhesive force generated at an interface between the first region and the adhesive member is less than or equal to 1.5 kg/mm2 and an adhesive force generated at an interface between the second region and the adhesive member is greater than or equal to 2.5 kg/mm2. ### Claim 2 (depends on 1) The electronic component according to claim 1, wherein the optical member has a larger linear coefficient of expansion than the electronic device. ### Claim 3 (depends on 1) The electronic component according to claim 1, wherein the optical member has a larger linear coefficient of expansion than the mount member. ### Claim 4 (depends on 1) The electronic component according to claim 1, wherein the film comprises a region facing the electronic device in the first direction. ### Claim 5 (depends on 1) The electronic component according to claim 1, wherein the base material of the first region constitutes a first part of the interface with the adhesive member, and the film of the second region constitutes a second part of the interface with the adhesive member. ### Claim 6 An electronic component comprising: an electronic device; an optical member facing the electronic device in a first direction; and an adhesive member disposed between the optical member and a mount member to bond the optical member and the mount member together, wherein the optical member comprises a base material and a film disposed between the base material and the adhesive member, wherein the optical member further comprises a first region and a second region, the first region being disposed outside the second region in a second direction intersecting the first direction, the second region being constituted by the base material and the film, the first region being constituted by the base material, the first region and the second region constituting an interface with the adhesive member, wherein a length L1 of the first region in the second direction satisfies 0.1 mm≤L1<0.5 mm, and a length L2 of the second region in the second direction satisfies 0.5 mm ≤L2≤2.5 mm, and wherein an adhesive force generated at an interface between the first region and the adhesive member is less than or equal to 1.5 kg/mm2 and an adhesive force generated at an interface between the second region and the adhesive member is greater than or equal to 2.5 kg/mm2. ### Claim 7 (depends on 6) The electronic component according to claim 6, wherein the first region has a smaller area than the second region. ### Claim 8 An electronic component comprising: an electronic device; a mount member to which the electronic device is fixed; an optical member facing the electronic device in a first direction; and a resin material disposed between the optical member and the mount member, wherein the optical member comprises a first region and a second region, the first region and the second region constituting an interface with the resin material, wherein the first region is disposed outside the second region in a second direction intersecting the first direction, wherein the optical member comprises glass made of either phosphate glass or fluorophosphate glass and a silicon oxide film, at least a part of the silicon oxide film is disposed between the phosphate or fluorophosphate glass and the resin material in the first direction, and wherein the interface between the second region and the resin material is constituted by the silicon oxide film, and the interface between the first region and the resin material is constituted by the phosphate or fluorophosphate glass, wherein the interface between the silicon oxide film of the second region and the resin material is wider in the second direction than the interface between the phosphate or fluorophosphate glass of the first region and the resin material. ### Claim 9 (depends on 8) The electronic component according to claim 8, wherein the resin material comprises an ultraviolet curable resin. ### Claim 10 (depends on 9) The electronic component according to claim 9, wherein a length L1 of the first region in the second direction satisfies 0.1 mm≤L1<0.5 mm, and a length L2 of the second region in the second direction satisfies 0.5 mm≤L2≤2.5 mm. ### Claim 11 (depends on 10) The electronic component according to claim 10, wherein the mount member is formed of resin, and the optical member comprises glass made of fluorophosphate glass. ### Claim 12 (depends on 8) The electronic component according to claim 8, wherein the silicon oxide film comprises another part directly facing a space between the optical member and the electronic device in the first direction. ### Claim 13 (depends on 12) The electronic component according to claim 12, wherein the silicon oxide film is in contact with the phosphate or fluorophosphate glass. ### Claim 14 (depends on 13) The electronic component according to claim 13, wherein the phosphate or fluorophosphate glass has a larger linear coefficient of expansion than the mount member. ### Claim 15 (depends on 8) The electronic component according to claim 8, wherein the electronic device comprises a photoelectric conversion element, and wherein a light receiving region of the photoelectric conversion element and the silicon oxide film face each other in the first direction.