# US 10,319,764 B2 · Image sensor and electronic device

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- Number: US 10,319,764 B2
- Document ID: US10319764B2
- Status: Granted
- Kind: B2
- Application number: 15/580,356
- Filed: 2016-06-03
- Published: 2018-06-14
- Granted: 2019-06-11
- Earliest claimed: 2015-06-18
- Assignees: Sony Corporation
- Applicants: Sony Corporation
- Inventors: Taro Sugizaki
- Web page: https://patentgrep.com/patent/US10319764B2

## CPC

- H10K 39/32: Organic image sensors
- H04N 25/702: SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
- H04N 25/703: SSIS architectures incorporating pixels for producing signals other than image signals
- H10F 39/12: Image sensors
- H10F 39/18: Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F 39/802: {Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes}
- H10F 39/8057: {Optical shielding}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H10F 39/809: {of hybrid image sensors}
- G02F 1/133512: {Light shielding layers, e.g. black matrix (G02F1/136209 takes precedence)}
- G02F 1/136209: {Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element}
- H04N 23/75: by influencing optical camera components
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS

## Abstract

The present technology relates to an image sensor and an electronic device capable of performing imaging in which mixed color is reduced. Photoelectric conversion layers including photoelectric conversion units separated in units of pixels are stacked in two or more layers, the image sensor is configured to include a state in which light incident on one pixel in a first photoelectric conversion layer closer to an optical lens is received by the photoelectric conversion unit in a second photoelectric conversion layer distant from the optical lens, the image sensor includes a light-shielding layer configured to shield light transmitted through the first photoelectric conversion layer, between the first photoelectric conversion layer and the second photoelectric conversion layer, the light-shielding layer has an opening to transmit the light from the first photoelectric conversion layer to the second photoelectric conversion layer, and the openings are made to be asymmetric with respect to the pixel in the first photoelectric conversion layer. The present technology can be applied to an image sensor with a multi-layered structure.

## Claims

### Claim 1

An image sensor, comprising:
a plurality of photoelectric conversion layers including a plurality of photoelectric conversion units, wherein
the plurality of photoelectric conversion units is separated in units of pixels,
the plurality of photoelectric conversion layers comprise a plurality of pixels that is stacked in at least two layers,
a first pixel of the plurality of pixels, in a first photoelectric conversion layer of the plurality of photoelectric conversion layers, is configured to receive incident light,
the first photoelectric conversion layer is closer to an optical lens,
a first photoelectric conversion unit of the plurality of photoelectric conversion units, in a second photoelectric conversion layer of the plurality of photoelectric conversion layers, is configured to receive the incident light transmitted through the first photoelectric conversion layer, and
the second photoelectric conversion layer is distant from the optical lens; and
a light-shielding layer configured to shield the light transmitted through the first photoelectric conversion layer, wherein
the light-shielding layer is between the first photoelectric conversion layer and the second photoelectric conversion layer,
the light-shielding layer is further configured to transmit the incident light from the first photoelectric conversion layer to the second photoelectric conversion layer through an opening in the light-shielding layer, and
the opening is asymmetric with respect to the first pixel in the first photoelectric conversion layer.

### Claim 2 (depends on 1)

The image sensor according to claim 1,
wherein the asymmetry of the opening with respect to the first pixel is based on an image height of the optical lens.

### Claim 3 (depends on 1)

The image sensor according to claim 1,
wherein the asymmetry of the opening with respect to the first pixel increases based on an increase in an image height of the optical lens.

### Claim 4 (depends on 1)

The image sensor according to claim 1, wherein
a first plurality of sides surrounding the opening is at a plurality of positions that is shifted from a second plurality of sides,
the second plurality of sides is of the first pixel in the first photoelectric conversion layer,
wherein a first side of the first plurality of sides is located on a central side of the optical lens,
a second side, of the first plurality of sides, is different from the first side,
the first side is shifted by a first shift amount and the second side is shifted by a second shift amount, and
the first shift amount is different from the second shift amount.

### Claim 5 (depends on 4)

The image sensor according to claim 4,
wherein the shift is in a horizontal direction.

### Claim 6 (depends on 4)

The image sensor according to claim 4,
wherein the shift is in a horizontal direction and a diagonal direction.

### Claim 7 (depends on 4)

The image sensor according to claim 4,
wherein the shift is in a vertical direction.

### Claim 8 (depends on 4)

The image sensor according to claim 4,
wherein the shift is in a vertical direction and a diagonal direction.

### Claim 9 (depends on 4)

The image sensor according to claim 4,
wherein the shift is in at least one of a horizontal direction, a vertical direction, or a diagonal direction.

### Claim 10 (depends on 1)

The image sensor according to claim 1,
wherein a second pixel of the first photoelectric conversion unit in the second photoelectric conversion layer is a phase difference detection pixel.

### Claim 11 (depends on 1)

The image sensor according to claim 1, further comprising
a light-shielding unit configured to shield the light transmitted through the opening, the light-shielding unit is between the light-shielding layer and the second photoelectric conversion layer, wherein
a second pixel of the first photoelectric conversion unit, is in a state in which the incident light is half shielded by the light-shielding unit, and
the first pixel is set as a phase difference detection pixel.

### Claim 12 (depends on 1)

The image sensor according to claim 1, further comprising
a light-shielding unit in a grid state, wherein the light-shielding unit is between the first photoelectric conversion layer and the second photoelectric conversion layer, and wherein the light-shielding unit is configured to shield the light transmitted through the first photoelectric conversion layer.

### Claim 13 (depends on 12)

The image sensor according to claim 12,
wherein the light-shielding unit includes a plurality of grids is adjacent to each other and in different directions.

### Claim 14 (depends on 1)

The image sensor according to claim 1, further comprising
a narrow-band filter between the first photoelectric conversion layer and the second photoelectric conversion layer,
wherein the light transmitted through the first photoelectric conversion layer arrives at the first photoelectric conversion unit of the second photoelectric conversion layer through the narrow-band filter.

### Claim 15 (depends on 1)

The image sensor according to claim 1, further comprising
a plasmon filter between the first photoelectric conversion layer and the second photoelectric conversion layer,
wherein the light transmitted through the first photoelectric conversion layer arrives at the first photoelectric conversion unit of the second photoelectric conversion layer through the plasmon filter.

### Claim 16 (depends on 1)

The image sensor according to claim 1, further comprising:
a Fabry-Perot interferometer between the first photoelectric conversion layer and the second photoelectric conversion layer,
wherein the light transmitted through the first photoelectric conversion layer arrives at the first photoelectric conversion unit of the second photoelectric conversion layer through the Fabry-Perot interferometer.

### Claim 17 (depends on 1)

The image sensor according to claim 1,
wherein the first photoelectric conversion unit in the second photoelectric conversion layer is a time of flight (TOF) type sensor.

### Claim 18 (depends on 1)

The image sensor according to claim 1,
wherein the first photoelectric conversion unit in the second photoelectric conversion layer is a light field camera.

### Claim 19 (depends on 1)

The image sensor according to claim 1,
wherein the first photoelectric conversion unit in the second photoelectric conversion layer is a sensor that images a subject and acquires an image.

### Claim 20

An electronic device, comprising:
an image sensor comprising:
a plurality of photoelectric conversion layers including a plurality of photoelectric conversion units, wherein
the plurality of photoelectric conversion units is separated in units of pixels,
wherein the plurality of photoelectric conversion layers comprises a plurality of pixels that is stacked in at least two layers, wherein
a first pixel of the plurality of pixels, in a first photoelectric conversion layer of the plurality of photoelectric conversion layers, is configured to receive incident light,
the first photoelectric conversion layer is closer to an optical lens
a first photoelectric conversion unit of the plurality of photoelectric conversion units, in a second photoelectric conversion layer of the plurality of photoelectric conversion layers, is configured to receive the incident light transmitted through the first photoelectric conversion layer,
the second photoelectric conversion layer is distant from the optical lens; and
a light-shielding layer configured to shield the light transmitted through the first photoelectric conversion layer, wherein
the light-shielding layer is between the first photoelectric conversion layer and the second photoelectric conversion layer,
the light-shielding layer is further configured to transmit the incident light from the first photoelectric conversion layer to the second photoelectric conversion layer through an opening in the light-shielding layer, and
the opening is asymmetric with respect to the first pixel in the first photoelectric conversion layer.
