# US 10,319,759 B2 · Image pickup element mounting substrate and image pickup device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,759 B2 - Document ID: US10319759B2 - Status: Granted - Kind: B2 - Application number: 15/316,916 - Filed: 2015-06-24 - Published: 2017-04-13 - Granted: 2019-06-11 - Earliest claimed: 2014-06-25 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Takuji Okamura; Akihiko Funahashi - Web page: https://patentgrep.com/patent/US10319759B2 ## CPC - H10F 39/804: {Containers or encapsulations} - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H05K 1/184: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes - H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)} - H10F 39/18: Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors - H10F 39/811: {Interconnections} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 3/005: {Punching of holes} - H05K 3/4629: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets} - H05K 2203/063: of preperforated insulating layer - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An image pickup element mounting substrate includes: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower surface side of the frame body; and a flat plate which is disposed on a lower surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate including an image pickup element mounting section at a part of an upper surface thereof which part is surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate. ## Claims ### Claim 1 An image pickup element mounting substrate, comprising: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower outer surface of the frame body; and a flat plate which is disposed on the lower outer surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate comprising an image pickup element mounting section at a first part of an upper surface of the flat plate, the first part of the upper surface being surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate. ### Claim 2 (depends on 1) The image pickup element mounting substrate according to claim 1, wherein the flat plate is provided with a flat-plate recess formed at a second part of the upper surface of the flat plate, the second part of the upper surface overlapping with the electronic component. ### Claim 3 (depends on 1) The image pickup element mounting substrate according to claim 1, wherein the flat plate is provided with a flat-plate through hole formed in a position which overlaps with the electronic component. ### Claim 4 (depends on 1) An image pickup device, comprising: the image pickup element mounting substrate according to claim 1; an image pickup element mounted on the image pickup element mounting section of the flat plate; and a lid body which is joined to an upper surface of the frame body and seals an interior of the frame body. ### Claim 5 (depends on 1) The image pickup element mounting substrate according to claim 1, wherein the flat plate is directly connected to the frame body. ### Claim 6 An image pickup element mounting substrate, comprising: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body, the frame body being provided with a frame-body recess which opens on a lower outer surface of the frame body; an electronic component mounted in the frame-body recess; and a flat plate which is disposed on the lower outer surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate comprising an image pickup element mounting section at a first part of an upper surface of the flat plate, the first part of the upper surface being surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate. ### Claim 7 (depends on 6) The image pickup element mounting substrate according to claim 6, wherein the flat plate is provided with a flat-plate recess formed at a second part of the upper surface of the flat plate, the second part of the upper surface overlapping with the frame-body recess. ### Claim 8 (depends on 6) The image pickup element mounting substrate according to claim 6, wherein the flat plate is provided with a flat-plate through hole formed in a position which overlaps with the electronic component. ### Claim 9 (depends on 6) An image pickup device, comprising: the image pickup element mounting substrate according to claim 6; an image pickup element mounted on the image pickup element mounting section of the flat plate; and a lid body which is joined to an upper surface of the frame body and seals an interior of the frame body. ### Claim 10 (depends on 6) The image pickup element mounting substrate according to claim 6, wherein the flat plate is directly connected to the frame body.